Molded Photosensitive Assembly for Wire-Safe Image Module Packaging
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Solution Overview
Problem
The existing image capturing module packaging processes, such as COB (Chip On Board), face challenges in reducing the overall size while maintaining imaging quality due to the deformation of lead wires during molding, which affects electrical signal transmission and increases defect rates, and the molding process alters the mounting relationship between the photosensitive element and the circuit board, impacting imaging quality.
Innovation Solution
The introduction of a molded photosensitive assembly with a supporting member that prevents the upper mold from pressing on lead wires, maintaining their shape and ensuring proper electrical connection, and using a molding process that integrates the supporting member to form a compact structure, reducing assembly errors and improving imaging quality.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If multiple discrete components (lens, sensor, filter, etc.) are assembled separately, then functional performance is achieved, but manufacturing complexity and assembly steps increase
Solution Approach 1:
The patent combines multiple discrete optical components (lens, image sensor, optical filter, illumination source, microlens array) into a single integrated photosensitive assembly. This merging eliminates multiple assembly steps while maintaining the functional performance of each component, directly resolving the contradiction between functional reliability and assembly complexity.
Solution Approach 2:
The photosensitive assembly serves multiple functions simultaneously: focusing light (lens), detecting images (sensor), filtering wavelengths (optical filter), providing illumination (illumination source), and enhancing light guidance (microlens array). This multi-functionality in a single integrated structure reduces the number of separate components and assembly operations required.
2Manufacturing precision
If conventional separate manufacturing processes are used for each component, then individual component quality is maintained, but production time and cost increase
Solution Approach 1:
The patent employs preliminary molding actions where support pins with precise dimensions are pre-formed and then used as masters to create negative impressions in the photosensitive material. This preliminary structuring ensures high manufacturing precision for critical features like pinhole apertures and recesses while enabling subsequent mass production through a single molding operation.
Solution Approach 2:
The manufacturing process utilizes parameter changes in the photosensitive material's state - transitioning from a moldable state (where it can be shaped around support pins) to a cured state (where it maintains the precise structure). This parameter change enables the material to capture fine geometric details during molding while maintaining structural integrity in the final product.
3Manufacturing precision
If support pins are used to define pinhole apertures, then manufacturing precision is improved, but additional components and assembly steps are required
Solution Approach 1:
The support pins are extracted from the final product after serving their purpose during manufacturing. The pins are removed from the molded photosensitive assembly, leaving behind precisely formed pinhole apertures and recesses. This extraction eliminates the support pins as permanent components while retaining the precision they provided during the molding process.
Solution Approach 2:
The support pins act as temporary intermediaries during manufacturing - they are introduced to define the geometry of pinhole apertures, used during the molding process to create precise negative impressions, and then removed. This intermediary role allows the pins to transfer their geometric precision to the final product without becoming permanent parts of the assembly.
4Strength
If adhesive layers are used to bond components, then component bonding is achieved, but optical interference and assembly complexity increase
Solution Approach 1:
The patent eliminates the adhesive layer from the optical path by reconfiguring the component arrangement. The image sensor is positioned such that its active surface is in direct contact with the optical filter, removing the need for adhesive bonding in the light path. This extraction of the adhesive layer eliminates optical interference while component bonding is achieved through alternative mechanical or direct contact methods.
Solution Approach 2:
The patent replaces the chemical bonding mechanism (adhesive layers) with a mechanical positioning system. Support pins with precisely engineered recesses and protrusions provide mechanical alignment and bonding between components, substituting the adhesive-based mechanical system with a geometry-based mechanical system that eliminates optical interference from adhesive materials.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively reduces the size of the image capturing module, enhances imaging quality by maintaining wire integrity and preventing short-circuits, and improves manufacturing efficiency by minimizing defects and maintaining the optimal mounting relationship between the photosensitive element and the circuit board.
Implementation Method 1
a first support pin and a second support pin, which extend in a first direction respectively, are disposed in a photosensitive material in a mold, and then the photosensitive material is irradiated with UV light from above to perform UV curing
Data Source
Figure 1
Figure 2A~2B
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AI summary
A molded photosensitive assembly of an image capturing module includes at least one supporting member formed by a first substance, at least one photosensitive element, at least one circuit board, at least one set of lead wires electrically connecting the photosensitive element to the circuit board, and at least one molded base. Two ends of each of the wires are respectively connected to a chip connector of the photosensitive element and a circuit connector of the circuit board. The molded base is formed by a second substance and comprises a molded body and has at least one light window, wherein the photosensitive element and the wires are protected by a supporting member which is provided for avoiding an upper mold of a molding-die pressing on the wires during the molding process.