Sealed Optical Engine Layout for High-Speed Liquid-Cooled Links
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Solution Overview
Problem
Existing optical engines face challenges in supporting higher data transfer rates, reducing size, and facilitating easy integration with other communication system components as bandwidth and channel density increase.
Innovation Solution
The optical engine features an optically transparent substrate with optoelectronic elements mounted on one surface and associated electrical components and a microcontroller on the other, enabling efficient light emission and reception while minimizing size and maximizing integration capabilities.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If optical engines use traditional substrate configurations with all components mounted on one side, then integration is simplified, but heat dissipation and signal interference increase
Solution Approach 1:
The patent divides the optical engine components into two separate groups mounted on opposite sides of the substrate: optoelectronic elements (VCSELs, photodetectors) on one side and electrical components (resistors, capacitors, inductors) on the other side. This segmentation separates heat-generating and signal-sensitive components, reducing thermal interference and electrical noise while maintaining integration benefits.
2Productivity
If optical engines increase component density to support higher data transfer rates, then bandwidth increases, but manufacturing precision requirements increase
Solution Approach 1:
The patent utilizes the third dimension (vertical stacking) by mounting different component types on opposite sides of the substrate rather than crowding all components on a single plane. This dimensional separation allows higher component density and data transfer rates without proportionally increasing lateral manufacturing precision requirements, as components are distributed across multiple layers/zones.
3Volume of moving object
If optical engines reduce substrate size to minimize device footprint, then integration density improves, but heat dissipation becomes more difficult
Solution Approach 1:
The patent segments heat-generating optoelectronic elements from electrical components and places them on opposite sides of the substrate. This spatial separation creates dedicated thermal management zones, allowing heat to dissipate more efficiently from the optoelectronic elements without being trapped by adjacent electrical components, thereby enabling compact device footprint while maintaining effective heat dissipation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enables high-speed data transfer rates, compact size, and improved integration with other components, addressing the limitations of current optical engines and enhancing performance in high-bandwidth communication systems.
Implementation Method 1
An optoelectronic element configured to emit or receive light through the transparent substrate
Data Source
AI summary
An optical engine having an optically transparent substrate with a lens on a first major surface and an optoelectronic element on an opposed second major surface is described. The optical engine has a sealed optical path and is capable of operating submerged in a cooling liquid. The optical engine may be attached to a mounting substrate to form an optoelectronic subassembly that may be incorporated in many different types of optical interconnects.