PCB Via Structure With Glass Optical Waveguide for Interlayer Transmission
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Solution Overview
Problem
Traditional organic packages face challenges in achieving high transmission speed and transparency, making it difficult to form optical waveguides effectively.
Innovation Solution
A printed circuit board design incorporating a via structure with a glass layer and optical waveguide pattern, inserted into a substrate cavity, enabling interlayer optical signal transmission.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Speed
If traditional organic packages are used, then manufacturing cost is low and technology is mature, but transmission speed is insufficient and transparency cannot be secured
Solution Approach 1:
The patent employs a composite structure combining glass substrate, dielectric layers, and metal patterns to create a printed circuit board that achieves both high transmission speed through optical waveguides and manufacturability through established glass processing techniques. The glass substrate serves as both the base material and the optical waveguide core, integrating multiple functions into a composite structure.
Solution Approach 2:
The patent replaces traditional electrical signal transmission through copper traces with optical signal transmission through glass waveguides. This substitution enables significantly higher transmission speeds by using light instead of electrical signals, while the glass substrate can be processed using mature glass processing technologies.
2Illumination intensity
If traditional organic packages are used, then cost is low, but transparency and optical waveguide formation are difficult
Solution Approach 1:
The patent applies local quality by creating a via structure with specific refractive index characteristics. The glass layer within the via structure has different optical properties (higher refractive index) compared to the surrounding dielectric material, enabling optical waveguide formation only in the necessary locations while maintaining overall board transparency.
Solution Approach 2:
The via structure acts as an intermediary element that bridges different layers and enables optical signal transmission. The glass layer within the via structure serves as the optical waveguide core, mediating between the substrate and upper layers to facilitate transparent optical signal transmission across multiple layers.
3Adaptability or versatility
If a via structure with glass layer and optical waveguide pattern is formed, then interlayer optical signal transmission is enabled, but manufacturing process complexity increases
Solution Approach 1:
The patent merges multiple functions into the via structure: the glass layer serves as both the fill material for the via cavity and the optical waveguide core. The dielectric layer both insulates the metal pattern and provides cladding for the optical waveguide. This merging reduces the number of separate components and simplifies the overall manufacturing process despite the advanced functionality achieved.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design secures sufficient transparency and facilitates easy formation of optical waveguides, enhancing data transmission speed and quality.
Implementation Method 1
a via structure including an optical waveguide pattern using a glass layer and insert the via structure into a cavity of a substrate, thereby enabling interlayer optical signal transmission
Data Source
AI summary
The present disclosure relates to a printed circuit board including: a substrate having a cavity; and a via structure at least partially disposed in the cavity, and the via structure includes a glass layer, a first optical waveguide pattern disposed on the glass layer, and a dielectric layer disposed on the glass layer and covering at least a portion of the first optical waveguide pattern.