Display PCB and Protective Film Layout for Reliable Pad Connection
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Solution Overview
Problem
Existing electronic apparatuses face challenges in improving durability and reliability, particularly in the connection between display panels and circuit boards, which can be enhanced by incorporating a circuit board between the display panel and a protective film.
Innovation Solution
The electronic apparatus includes a circuit board positioned between a display module and a protective film, featuring substrate pads connected through an anisotropic conductive film, with insulating layers and signal lines, and a protective film that does not overlap the substrate pads on a plane, enhancing durability and reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a circuit board is disposed between a display panel and a protective film, then durability and reliability are improved, but device complexity increases
Solution Approach 1:
The circuit board is nested between the display panel and protective film, creating a layered structure where multiple functional components are integrated in a compact arrangement. The driving element is further nested within an accommodation hole of the protective film, maximizing space utilization while maintaining structural integrity and improving overall durability.
Solution Approach 2:
The circuit board is segmented into distinct functional areas with first and second substrate pads separated on opposite surfaces. This segmentation allows independent connection to the display panel and driving element, improving reliability by isolating potential failure points while maintaining a relatively simple overall structure.
2Reliability
If substrate pads are exposed on the circuit board for connection, then electrical connectivity is improved, but vulnerability to external impacts increases
Solution Approach 1:
The protective film is positioned to cover and protect the circuit board substrate pads from external impacts and environmental damage. This beforehand protection ensures that the electrical connection points remain vulnerable to fewer harmful factors while maintaining their electrical functionality, as the protective film acts as a shield against physical damage.
Solution Approach 2:
The anisotropic conductive film serves as an intermediary between the first substrate pad and the display panel, providing both electrical connectivity and mechanical protection. This intermediary layer ensures reliable electrical connection while cushioning the substrate pad from direct exposure to external impacts.
3Reliability
If insulating layers and signal lines are included in the circuit board, then electrical performance is improved, but manufacturing complexity increases
Solution Approach 1:
The circuit board utilizes standard insulating layer materials such as polyimide and polyethylene terephthalate (PET) with established physical and electrical properties. By selecting materials with known parameters and characteristics, the electrical performance is optimized while leveraging existing manufacturing processes and material availability to manage manufacturing complexity.
Solution Approach 2:
The circuit board employs composite construction with multiple insulating layers made from different materials (polyimide, PET) combined with conductive signal lines and substrate pads. This composite structure achieves superior electrical performance through material synergies while utilizing established composite manufacturing techniques to control production complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration improves the durability and reliability of the electronic apparatus by providing a robust connection between the display module and circuit board, while also offering protection against external impacts and heat dissipation.
Implementation Method 1
a tape automated bonding (TAB) mounting method uses an anisotropic conductive film (ACF) to bond a circuit board to a display panel
Implementation Method 2
a plurality of substrate insulating layers disposed on the first solder resist layer and including at least one of polyimide and polyethylene terephthalate (PET)
Data Source
Figure 1
Figure 2A
Figure 2B
AI summary
An electronic apparatus (EA) including a display module (DM) having a front surface (IS) and a rear surface (IU) opposing the front surface (IS) and including pixels (PX) disposed on the front surface (IS) and a display pad (VP) connected to the pixels (PX) and exposed from the rear surface (IU), a protective film (PF) disposed on the rear surface (IU) of the display module (DM), a circuit board (PCB) disposed between the display module (DM) and the protective film (PF) and having a front surface (PS) facing the rear surface (IU) of the display module (DM, DM-1) and a rear surface (PU) opposite to the front surface (PS), the circuit board (PCB) including a first substrate pad (CP) connected to the display pad (VP) and exposed from the front surface (PS) of the circuit board (PCB) and a second substrate pad (IP) exposed from the rear surface (PU) of the circuit board (PCB), and a driving element (D-IC) connected to the second substrate pad (IP) to drive the pixels (PX), in which the second substrate pad (IP) and the protective film (PF) are spaced apart from each other.