Electro-Optical Substrate Assembly for High-Density Hybrid Packaging

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Solution Overview

Problem

Conventional substrate packaging technologies face challenges in integrating high-performance optical communication, leading to complex manufacturing processes, high costs, and limitations in heterogeneous multi-material integration and high-density stacking.

Innovation Solution

A heterogeneous integration design concept is adopted, enabling coplanar or stacked arrangements of conductive-trace and optical-trace layers on a single or multi-layer substrate, supporting high-density electro-optical hybrid communication with diverse process flexibility and material choices.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If conventional substrate packaging technologies are used to achieve electrical connections, then electrical connectivity is established, but integration of high-performance optical communication becomes complex and costly

Engineering Contradiction:

Improveintegration capability of optical communicationVSAvoidmanufacturing process complexity

Core Design Contradiction:

Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The patent merges electrical and optical trace layers into a single composite-layered structure that can be fabricated using unified manufacturing processes. The conductive-trace layers and optical-trace layers are integrated within the same substrate system, allowing simultaneous production of both electrical and optical interconnects without requiring separate complex assembly processes.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The composite-layered structure serves multiple functions: it provides both electrical connectivity through conductive-trace layers and optical communication through optical-trace layers. The bonding layer and substrate structure are designed to support both types of signal transmission, making the packaging system universally capable of handling mixed-signal applications.

Inventive Principle:

Principle #6Universality (Multi-functionality)

2Adaptability or versatility

If heterogeneous multi-material integration is implemented, then material diversity and design flexibility are improved, but manufacturing process complexity increases

Engineering Contradiction:

Improvematerial integration capabilityVSAvoidmanufacturing process simplicity

Core Design Contradiction:

Adaptability or versatilityVSEase of manufacture

Solution Approach 1:

The patent segments the packaging structure into distinct functional layers: substrate, bonding layer, composite-layered structure with conductive-trace layers, optical-trace layers, and encapsulant. Each layer can be optimized independently for its specific function while being manufactured using standardized sequential processes, reducing overall manufacturing complexity despite material diversity.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The patent employs composite-layered structures that combine different materials (conductive materials for electrical traces, optical materials for optical traces, bonding materials) into an integrated architecture. These composite structures are fabricated using established semiconductor packaging processes that can handle multiple materials in a unified manufacturing flow.

Inventive Principle:

Principle #40Composite materials

3Quantity of substance

If high-density stacking is achieved, then packaging density is improved, but manufacturing precision requirements increase

Engineering Contradiction:

Improvepackaging densityVSAvoidalignment precision

Core Design Contradiction:

Quantity of substanceVSManufacturing precision

Solution Approach 1:

The patent transitions from planar 2D trace layouts to 3D stacked architectures by arranging conductive-trace layers and optical-trace layers in multiple vertical levels. The bonding layer and substrate structure are designed to support this vertical stacking, enabling high-density integration through the third dimension while using standard alignment processes adapted for multi-layer fabrication.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

Data Source

PatentUS20250386428A1Substrate assembly and electronic device

Publication Date: 2025.12.18 PANELSEMI CORP

AI summary

The present invention provides a substrate assembly including a substrate, a composite-layered structure and a bonding layer. The composite-layered structure defines a conjunction plane, and one or more conductive-trace layers and one or more optical-trace layers are arranged either or both of over and beneath the conjunction plane; wherein the optical-trace layer defines a plurality of optical traces, and the conductive-trace layer defines a plurality of conductive traces. The bonding layer is adhesive between the substrate and the composite-layered structure. The present invention also provides an electronic device including a substrate assembly and a plurality of semiconductor components arranged on the composite-layered structure of the substrate assembly; wherein some of the semiconductor components are electrically connected to the conductive-trace layers, and some of the semiconductor components are optically communicated with the optical-trace layers.