Stepped Wiring Board Layout for Compact Hermetic Light Emitters
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Solution Overview
Problem
Current wiring boards and light-emitting devices face challenges in miniaturization due to limitations in design and component placement, leading to increased size and complexity.
Innovation Solution
A wiring board design with distinct upper surfaces and mounting surfaces, featuring a wiring layer configuration that includes pad and pattern portions of varying lengths to optimize space usage, allowing for miniaturization of light-emitting devices by strategically placing components on different surfaces and using a cap and lid structure for hermetic sealing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If components are arranged on a single flat surface, then the layout is simple, but the device size increases
Solution Approach 1:
The wiring board employs a three-dimensional stacked configuration with multiple surfaces at different heights. The first upper surface contains a first wiring layer with pad and pattern portions, while the second upper surface at a higher level contains a second wiring layer. This vertical arrangement allows components to be positioned in multiple layers, reducing the horizontal footprint and enabling device miniaturization without excessive structural complexity.
2Length of moving object
If the wiring layer is extended to connect distant regions, then connectivity is achieved, but the wiring length increases
Solution Approach 1:
The first wiring layer extends from the first pad portion in the first wiring region through a connecting region to connect with the second wiring layer. By utilizing the vertical dimension and overlapping regions between different surfaces, the wiring path is optimized to reduce total length while maintaining reliable electrical connection between distant components through the multi-layer structure.
3Length of stationary object
If all wiring regions are exposed for access, then connection access is easy, but the device height increases
Solution Approach 1:
The wiring board divides wiring regions into exposed and non-exposed segments. The first wiring region with the first pad portion is exposed for connection access, while the second wiring region with the second pad portion is positioned in a non-exposed region. This segmentation allows essential connections to be accessible while other wiring regions are concealed, reducing overall device height without compromising necessary wiring access.
Data Source
AI summary
A wiring board includes: an insulating member having a first upper surface, and a second upper surface located higher than the first upper surface; and a first wiring layer located on the first upper surface. The first upper surface has a wiring region that does not overlap with the second upper surface in a top view, and that is located in an exposed region. The first wiring layer extends from the wiring region to a connecting region that is connected to the wiring region, that overlaps with the second upper surface in a top view, and that is not exposed. The first wiring layer comprises a first pad portion located in the wiring region, and a first pattern portion located in the connecting region.