Non-Soldering Sensor Lens Assembly for Miniaturized Chip Packaging
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Solution Overview
Problem
Conventional sensor lens assemblies are limited by the need for a soldering process, which restricts structural configuration improvements and requires high-temperature resistant connections, increasing material costs and production complexity.
Innovation Solution
A non-soldering sensor lens assembly configuration that includes a circuit board, optical module, sensor chip, extending wall, wires, supporting adhesive layer, and light-permeable sheet, allowing for lower temperature resistance requirements and simplifying the production process by eliminating the need for soldering, while enabling miniaturization of the sensor chip.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a soldering process is used to fix the sensor package structure onto the circuit board, then the connection between components can resist high temperature, but the structural configuration is limited and material costs increase
Solution Approach 1:
The patent extracts and eliminates the soldering process from the manufacturing flow. Instead of using solder to fix the sensor package structure onto the circuit board, the invention uses a direct adhesive bonding method between the circuit board and the optical module, thereby removing the constraint of high-temperature resistance requirements and enabling greater structural configuration flexibility.
Solution Approach 2:
The patent replaces the mechanical/soldering connection system with an adhesive bonding system. The sensor package structure is bonded to the circuit board using adhesive materials rather than solder, and the optical module is fixed using adhesive layers, substituting the high-temperature soldering process with a lower-temperature adhesive bonding process that allows for improved structural design.
2Strength
If a soldering process is used to fix the sensor package structure, then the connection is strong, but the production process becomes complex and material costs increase
Solution Approach 1:
The patent removes the soldering process from the manufacturing sequence, eliminating the complexity associated with soldering operations, equipment requirements, and quality control. The sensor package structure and optical module are bonded using adhesive materials applied directly to the surfaces, simplifying the production process while maintaining connection strength through proper adhesive selection and bonding process optimization.
3Temperature
If conventional sensor package structure is used with soldering, then high-temperature resistance is achieved, but manufacturing precision is constrained
Solution Approach 1:
The patent replaces the soldering-based fixation system with an adhesive bonding system that allows for better control of assembly precision. The adhesive layers can be applied with controlled thickness and positioning, enabling more precise alignment of the optical module with the circuit board and the sensor chip with the optical module, thereby improving manufacturing precision while eliminating high-temperature resistance requirements.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The non-soldering configuration reduces material costs, increases product yield, and simplifies the production process by lowering high-temperature resistance requirements, while allowing for the assembly of smaller sensor chips, aligning with industry trends in miniaturization.
Implementation Method 1
The supporting adhesive layer is in a ringed shape. The supporting adhesive layer is disposed on the extending top surface of the extending wall and the top surface of the sensor chip
Implementation Method 2
The light-permeable sheet has two opposite surfaces respectively coated with two anti-reflective films thereon that respectively define an inner surface and an outer surface
Data Source
AI summary
A sensor lens assembly having a non-soldering configuration is provided. The sensor lens assembly includes a circuit board, an optical module fixed to the circuit board, a sensor chip and an extending wall both assembled to the circuit board, a plurality of wires electrically coupling the sensor chip and the circuit board, a supporting adhesive layer, and a light-permeable sheet. The extending wall surrounds the sensor chip and has an extending top surface that is substantially flush with a top surface of the sensor chip. The supporting adhesive layer is in a ringed shape and is disposed on the extending top surface of the extending wall and the top surface of the sensor chip. The light-permeable sheet is disposed on the supporting adhesive layer, so that the light-permeable sheet, the supporting adhesive layer, and the top surface of the sensor chip jointly define an enclosed space.