LED Lamp Panel Reflective Window Structure for Die Bonding
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Solution Overview
Problem
Existing LED lamp panels face challenges such as poor die bonding, limited lighting effect, and high manufacturing costs due to issues like inadequate reflectivity of white ink, thermal expansion mismatch between substrates and encapsulant layers, and limited options for BT substrates.
Innovation Solution
The proposed LED lamp panel includes a substrate with a circuit composite layer and bonding pads, a first reflective layer with window structures, and a second reflective layer filled in the accommodating area between the LED chip and the first reflective layer. This design improves die bonding, enhances lighting effect, and reduces manufacturing costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a window-forming treatment of white ink is performed on the glass substrate to expose the bonding pad for LED chip welding, then die bonding is facilitated, but the lighting effect is greatly affected due to light loss through the glass or ink coverage of the bonding pad
Solution Approach 1:
The patent extracts the bonding pad area from the white ink coating by creating a window structure, allowing the bonding pad to be exposed for die bonding while the surrounding area maintains the white ink's light-reflecting function. This separation resolves the conflict between needing exposed bonding pads and maintaining lighting effect.
Solution Approach 2:
The patent applies different properties to different areas: the bonding pad area has no white ink coating to enable electrical connection, while the surrounding area has white ink coating to reflect light. This local differentiation allows both die bonding convenience and lighting effect to coexist.
2Ease of manufacture
If the window size for bonding pad exposure is increased, then die bonding is facilitated, but light emitted by the LED is lost through the glass
Solution Approach 1:
The bonding pad area is extracted as a specific window region where white ink is removed, allowing precise exposure of the bonding pad without unnecessarily increasing the window size. This minimizes light loss while ensuring adequate bonding pad access.
3Loss of energy
If the window size for bonding pad exposure is decreased, then light loss is reduced, but the ink covers the bonding pad and causes poor die bonding
Solution Approach 1:
The patent creates a localized window area with precise dimensions that expose only the bonding pad while minimizing the surrounding exposed glass area. This local quality approach ensures adequate bonding pad exposure for good die bonding while minimizing light loss through the glass substrate.
4Shape
If a reflective layer is covered directly above the LED chip to increase light emitting angle and uniformity, then light distribution is improved, but light is repeatedly reflected and absorbed by the substrate, reducing brightness
Solution Approach 1:
The patent uses a composite structure combining white ink (a diffuse reflective material) with the glass substrate. This composite approach provides both light diffusion for uniformity and maintains high brightness by avoiding the light absorption problems of opaque reflective layers, while still achieving improved light emitting angle.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables improved die bonding, increased lighting effect, and reduced manufacturing costs by utilizing a reflective layer structure that enhances light reflectivity and reduces thermal stress, while also allowing for better color consistency and luminous brightness adjustment.
Implementation Method 1
a first reflective layer is disposed on the circuit composite layer... so that the light emitted from the front of the LED chip can be reflected to the two sides
Implementation Method 2
a second reflective layer filled in the accommodating area... the reflectivity of the second reflective layer is less than that of the first reflective layer
Implementation Method 3
a first encapsulant layer that is disposed on one side of the substrate, covers the LED chip and the circuit layer, and allows the light emitted by the LED chip to pass through
Implementation Method 4
a second encapsulant layer disposed on the other side of the substrate for partially or completely offsetting the stress generated by the first encapsulant layer on the substrate
Data Source
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AI summary
The present disclosure is applicable for the technical field of LEDs and provides an LED lamp panel which comprises a substrate that is provided with a circuit layer. The circuit layer is provided with bonding pads for connecting with a plurality of LED chips. The circuit layer is provided with a first reflective layer. The first reflective layer is provided with a plurality of window structures, which are disposed in an array. At least one pair of bonding pads for connecting with the LED chips is distributed in each of the window structures. The LED lamp panel further comprises a second reflective layer filled between the first reflective layer and the LED chips. The reflectivity of the second reflective layer is greater than that of the first reflective layer. The LED lamp panel provided by the present disclosure is conducive to die bonding and has a high lighting effect, an improved process yield, and a low manufacturing cost.