PCB Side Landing Pads for Multi-Orientation Optoelectronic Chips
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Solution Overview
Problem
Existing printed circuit boards (PCBs) for mounting optoelectronic chips, such as VCSELs, lack the ability to accommodate different orientations without affecting response characteristics, leading to the need for multiple PCB designs for varying chip orientations, which complicates fabrication and increases mechanical collisions.
Innovation Solution
A PCB design with side landing pads featuring multiple, differently oriented bonding areas that ensure equal electrical connection lengths for all orientations, allowing a single PCB to accommodate optoelectronic chips in various orientations, thus eliminating the need for multiple PCBs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If a single PCB design is used for mounting optoelectronic chips in different orientations, then fabrication complexity is reduced and manufacturing efficiency is improved, but maintaining equal electrical connection lengths for all orientations becomes difficult
Solution Approach 1:
The patent applies asymmetry by designing landing pads with multiple bonding areas that have different geometric orientations but are strategically positioned to maintain equal electrical connection lengths. The asymmetric arrangement of bonding areas on each landing pad allows chips to be mounted in different orientations while the symmetric electrical path lengths from each bonding area to the via ensure consistent electrical characteristics regardless of chip orientation.
2Reliability
If multiple PCB designs are used to accommodate different chip orientations, then electrical connection characteristics can be optimized for each orientation, but device complexity and fabrication cost increase
Solution Approach 1:
The patent implements universality by designing a single PCB layout that can accommodate optoelectronic chips in multiple orientations (e.g., 0°, 90°, 180°, 270°). Each landing pad contains multiple bonding areas arranged differently, allowing the same PCB to serve multiple mounting orientation functions. This multi-functional design eliminates the need for separate PCB designs for different chip orientations while maintaining reliable electrical connections.
3Adaptability or versatility
If landing pads have multiple differently oriented bonding areas, then adaptability to different chip orientations is improved, but landing pad design complexity increases
Solution Approach 1:
The patent applies segmentation by dividing each landing pad into multiple distinct bonding areas, where each bonding area has a specific orientation and shape suitable for bonding in a particular direction. This segmentation allows the landing pad to accommodate chips mounted in different orientations by providing appropriately oriented bonding surfaces for each case, while the overall landing pad structure remains organized and manageable.
Data Source
AI summary
A printed circuit board (PCB) having a lateral extent and comprising a side landing pad for direct bonding of an optoelectronic chip, whereby the side landing pad comprises at least two landing areas being differently oriented with regard to the lateral, thus enabling a bonding of the chip in at least two different lateral orientations relative to the printed circuit board, whereby the electrical connection lengths of the landing areas are equal, and an optoelectronic module based on such a printed circuit board and an according time of flight camera.