Radio frequency transmission circuit board and manufacturing method thereof
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Solution Overview
Problem
Conventional communication devices face challenges in high-frequency and high-speed signal transmission due to high transmission loss through metal wires, limited lightweight and bendability, and the integration of optical components that restrict space utilization.
Innovation Solution
A radio frequency transmission circuit board design incorporating a multilayer structure with optical fibers, reflective layers, and optoelectronic components, allowing for high-frequency and high-speed transmission with reduced loss and enhanced bendability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If metal wires are used for signal transmission, then electrical connection is established, but transmission loss increases at high frequencies
Solution Approach 1:
The patent replaces metal wire electrical transmission with optical fiber optical transmission. The optical transmission system uses light signals instead of electrical signals, fundamentally substituting the transmission mechanism to achieve lower transmission loss at high frequencies while maintaining reliable signal transmission quality.
Solution Approach 2:
The patent changes the transmission medium from metal (electrical conductor) to optical fiber (optical conductor), altering the fundamental transmission parameter from electrical signal to optical signal. This parameter change enables high-frequency transmission with reduced loss by exploiting the optical domain's advantages at these frequencies.
2Loss of energy
If optical fiber transmission lines are disposed outside the circuit board, then signal transmission is achieved, but device weight increases
Solution Approach 1:
The patent merges the optical fiber transmission line with the circuit board structure by embedding the optical fiber within the circuit board layers. This integration combines the previously separate optical transmission function with the mechanical support structure, achieving weight reduction while maintaining low transmission loss performance.
Solution Approach 2:
The patent nests the optical fiber within the multilayer circuit board structure, placing the optical transmission medium inside the board's internal layers. This nesting approach allows the optical fiber to be housed within the existing structural framework, eliminating the need for external mounting and reducing overall device weight.
3Illumination intensity
If embedded mirror is used for light reflection, then light transmission is enabled, but circuit board thickness is limited and heterogeneous interface separation risks increase
Solution Approach 1:
The patent extracts the light reflection function from the traditional embedded mirror and implements it through the geometric geometry of the blind hole structure itself. By using the blind hole's shape and positioning to achieve light reflection and guidance, the design eliminates the need for separate mirror components, reducing structural complexity and heterogeneous interfaces while maintaining effective light transmission.
4Ease of manufacture
If conventional circuit board structure is used, then manufacturing is simplified, but bendability is lost and space utilization is limited
Solution Approach 1:
The patent segments the circuit board into multiple flexible layers that can be independently formed and assembled. The multilayer structure with embedded optical fibers is divided into separable sections that can be bent and configured to fit different spatial requirements, maintaining manufacturing simplicity through modular construction while enabling bendability for enhanced adaptability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design achieves low transmission loss, lightweight, and flexibility for different space applications by utilizing optical fibers and reflective layers, supporting high-frequency and high-speed communication.
Implementation Method 1
The optical fiber is embedded in the first multilayer structure. The optical fiber has a first end and a second end opposite to the first end. The first end is connected to the lens. The optoelectronic coupling component is embedded in the first multilayer structure and is connected to the second end of the optical fiber.
Implementation Method 2
The blind hole extends from the second metal layer to the first dielectric layer. A reflective layer is arranged at a bottom end of the blind hole.
Data Source
AI summary
A radio frequency transmission circuit board has a bending portion, a signal transmitting portion and a signal receiving portion, and includes a first multilayer structure, a second multilayer structure, a third multilayer structure, a blind hole, a lens and an optical fiber. The blind hole extends from the second multilayer structure to the first multilayer structure. A reflective layer is arranged in the blind hole. The lens is embedded in the first multilayer structure and partially exposed in the blind hole. The optical fiber is embedded in the first multilayer structure and connected to the lens. The bending portion does not include the second multilayer structure and the third multilayer structure. The blind hole and the lens are located in the signal transmitting portion. The optical fiber is located in the bending portion.