Substrate Extension Interconnects for Dense Electrical-Optical Packaging
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Solution Overview
Problem
Existing interconnect solutions for semiconductor devices in high-performance computation systems, particularly for machine learning and artificial intelligence applications, are inadequate in terms of efficiency and robustness, leading to increased complexity, parasitic losses, and limited connection density, especially when integrating both electrical and optical connections.
Innovation Solution
The integration of substrate extensions with electrical and optical connections, allowing for customized base substrates that accommodate both types of connections without increasing module size, through scalable interconnects that reduce signal routing through the module and motherboard, using copackaged copper and optics with optimized signal paths and power delivery.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If traditional interconnect solutions are used for semiconductor devices, then module size can be kept compact, but connection density and signal routing efficiency deteriorate
Solution Approach 1:
The patent introduces substrate extensions that protrude from the base substrate in a directional manner, effectively adding spatial dimensionality to the interconnect architecture. This allows signal routing to occur in extended regions rather than being confined to the planar base substrate, thereby increasing connection density without proportionally increasing overall module footprint or routing complexity
Solution Approach 2:
The interconnect structure is segmented into distinct functional regions: base substrate for core processing, substrate extensions for I/O connections, and dedicated connection regions for electrical and optical interfaces. This segmentation allows each region to be optimized independently, improving connection density while managing complexity through functional separation
2Productivity
If both electrical and optical connections are integrated into the module, then communication bandwidth is improved, but module design complexity and manufacturing difficulty increase
Solution Approach 1:
The base substrate is designed as a universal platform that supports both electrical and optical connection types through standardized mounting interfaces and integrated circuitry. The substrate extensions provide a common structural framework that can accommodate different connection technologies, allowing the same base module design to support multiple communication modalities without requiring entirely separate design suites
Solution Approach 2:
The substrate extensions act as intermediary structures that bridge the base substrate and the external electrical/optical connection components. These extensions provide mechanical support, electrical connectivity, and signal routing pathways that facilitate the integration of diverse connection types while maintaining a unified module architecture, thereby simplifying manufacturing processes
3Use of energy by moving object
If signal routing is reduced through the module and motherboard, then power consumption and latency are improved, but interconnect solution complexity increases
Solution Approach 1:
The patent extracts the I/O connection functions from the base substrate and relocates them to dedicated substrate extensions. This separation extracts the signal routing paths that would otherwise traverse through the entire module and motherboard, confining high-speed signals to localized pathways on the extensions. This reduces the length and complexity of signal routes, thereby lowering power consumption and latency while managing interconnect complexity through functional specialization
Data Source
AI summary
The present invention is directed to semiconductor devices and packages. According to an exemplary embodiment, one or more substrate extensions are coupled to a base substrate, with portions of one or more substrates extending beyond the base substrate. Electrical and/or optical connections are connected to these substrate extensions. There are additional embodiments as well.