Camera Module Flexible Board Reinforcement for Positioning Accuracy

Resolve Bottlenecks,
Find Innovative SolutionsGenerate Solutions

Solution Overview

Problem

Camera modules with a sandwich structure face challenges in maintaining optical module positioning accuracy and heat dissipation performance due to deformation of flexible boards under optical module mounting, leading to potential connection failures and reduced heat dissipation.

Innovation Solution

Incorporating a reinforcing member around the circumference of the image pickup element on the flexible board, which is joined to face the area where the optical module is attached, maintains the openness of the image pickup element's circumference and supports the flexible board, preventing deformation and ensuring accurate positioning and heat dissipation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Volume of moving object

If a flexible board is used as the circuit board in a sandwich structure camera module, then the height of the camera module can be reduced and manufacturing can be simplified, but the flexible board deforms when the optical module is mounted, reducing positioning accuracy and potentially causing connection failures

Engineering Contradiction:

Improvecamera module heightVSAvoidoptical module positioning accuracy

Core Design Contradiction:

Volume of moving objectVSManufacturing precision

Solution Approach 1:

The patent applies local quality by adding a reinforcing member only at specific locations (around the image pickup element) rather than making the entire flexible board rigid. This localized reinforcement prevents deformation at critical areas while maintaining the overall flexibility and thin profile of the camera module.

Inventive Principle:

Principle #3Local quality

Solution Approach 2:

The patent uses composite materials by combining the flexible board with a reinforcing member made of different material properties. The reinforcing member provides structural support and rigidity where needed, while the flexible board maintains its flexibility and thin characteristics, creating a composite structure that achieves both goals.

Inventive Principle:

Principle #40Composite materials

2Reliability

If the circumference of the image pickup element is sealed by a frame member, then signal conduction is improved, but heat dissipation performance is reduced

Engineering Contradiction:

Improvesignal conductionVSAvoidheat dissipation performance

Core Design Contradiction:

ReliabilityVSTemperature

Solution Approach 1:

The reinforcing member is designed with selective openness - it reinforces areas needing structural support while leaving openings in regions that require heat dissipation. This local differentiation allows simultaneous achievement of structural reinforcement and thermal management without compromising signal conduction.

Inventive Principle:

Principle #3Local quality

Data Source

PatentUS11356584B2Camera module, production method, and electronic device

Publication Date: 2022.06.07 SONY SEMICON SOLUTIONS CORP

AI summary

The present technology relates to a camera module, a production method, and an electronic device that can prevent reduction of optical module positioning accuracy or heat dissipation performance. An image pickup element is joined on one face of a flexible board so that a light receiving surface of the image pickup element is exposed through an opening of the flexible board, and an optical module is joined on an other face of the flexible board. A reinforcing member is joined on the one face of the flexible board at a circumference of the image pickup element and reinforces a joining part of the flexible board where the optical module is joined. The reinforcing member is joined so as to face an area including at least a part of the joining part and is formed so that a part of the circumference of the image pickup element is kept open.