Circuit Bendability/Stretchability TRIZ Cases

Replacing mounting screws and gaskets with adhesive seals reduces manufacturing costs and contamination risks in storage drive assemblies.

Island-shaped bumps on a flexible substrate compress vertically to allow horizontal flattening, preventing circuit breaks during stretching.

A printed circuit board radiator uses an intermediate layer to align thermal and electrical conductive paths.

A semi-flexible printed circuit board uses thermal modification to reduce flexural rigidity in connecting sections.

Segmented substrates with porous strain relief features absorb macroscopic deformation while maintaining circuit integrity.

Replacing manual spring contact assembly with an integrated electronic load switch reduces manufacturing costs and eliminates separate temperature sensors.

A flexible printed circuit uses a liquid conductive substance in a cavity to maintain electrical connectivity during mechanical stretching.

Meander conductive leads on flexible substrates enable planar bending for solid state lighting modules.

Selective reinforcing layers in specific wiring areas increase impact strength, reducing tear risks during assembly.

A reinforcing member supports a flexible board in a camera module to maintain optical module positioning accuracy.

A circuit board design with a disconnection preventing portion electrically couples pattern areas at the fold boundary.

Cavities in non-conductive layers route feeding lines to conductive patches within a compact antenna module structure.

Bending a protruding area allows the touch circuit board to overlap the display panel, reducing light shielding area while maintaining structural stability.

A stretchable wiring board uses a meandering shape section with controlled amplitude and wavelength to accommodate substrate extension.

A stretchable substrate connects to a sensor electrode to resolve the contradiction between sensing accuracy and user irritation.

Bent flexible printed circuit board accommodates optical module rotation without increasing drive current.

Rear surface wire grouping via flexible printed circuits minimizes bezel width while managing wiring complexity in electronic apparatuses.

Stiffness reinforcement on flexible printed circuit boards prevents warping during bump press-fitting.

An irregular via hole shape enhances plating solution flow velocity to ensure reliable electrical connections between conductive layers.

A stretchable trace uses circular segments with varying central angles to distribute tensile stress across multiple directions.

A flexible circuit board electrically connects power pads on a main display board to supply voltage without occupying central signal areas.

Segmented conductive traces with polymer alignment prevent cracking during bending, ensuring reliable signal transmission.

A flexible electronics assembly uses stress channels and a substrate cavity to dissipate heat from components.

A flexible wiring assembly with a cradle and articulated structure flexes to conform to curved surfaces, enabling secure data transfer.

A tub-shaped housing secures a printed circuit board using molded position fixing formations and resilient tabs pressed by upper part pins.

Rigidity reduction portions in the connection substrate prevent distortion during camera movement, resolving interference with image stabilization.

Flexible joints with varying Young's moduli distribute stress uniformly across an auxetic stretchable substrate, preventing non-uniform deformation.

A light guide illuminates indicators through a seamless fabric exterior, preventing moisture damage while reducing component failure risks.

Segmented elastomer strips reduce pin friction, maintaining signal integrity during high-speed tri-temperature testing.

Exposed dummy lines at folded portions increase plasticity to suppress bending repulsive force, preventing adhesive peeling and lowering manufacturing costs.

A flexible wired circuit board production method uses a peeling layer and seed layer to form conductive patterns on insulating resin.

Asymmetric metal plates in the connecting portion distribute stress during bending, preventing excessive stretching and maintaining signal line characteristics.

A fiber sheet combines a thermosetting resin layer with a fabric base to deliver stretchability and structural integrity for flexible electronics.

A polyimide substrate with Z-shaped wiring patterns expands to accommodate electronic component mounting.

A flexible circuit film uses a crack-preventing portion on the base substrate to reinforce signal transmission lines.

A flexible circuit board uses a surface metal layer to secure external elements without direct soldering.

Curved wiring sections on a flexible substrate enable elastic extension and contraction, dispersing stress concentration to prevent breakage during deformation.

A structural tuning element on a substrate film locally controls deformation, preventing damage to fragile components during complex shape formation.

A printed film electrostatic concentrator uses patterned carbon ink electrodes to propel radon progeny toward a sensor.

The stretchable wiring board eliminates surface unevenness from protruding terminals by positioning the connection portion flush with the overcoat layer, ensuring user comfort while maintaining electrical connectivity.

A stretchable electrical connecting element integrates conductive and thermally adhesive resin threads to join wearable sensors.

Plasma bonding creates covalent adhesion between silicon wafers and silicone substrates, resolving brittle conductive adhesive cracking under strain.

A continuous semiconductor process forms electronic devices and metal wiring on a patterned polymer film substrate.