Z-Shaped Wiring Pattern for Stretchable Substrate Tensile Strength
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional stretchable substrates face issues with softness, flexibility, and tensile strength, particularly when bent or curved, leading to potential cracking or separation of electronic parts and complex, costly manufacturing processes for metal wiring.
Innovation Solution
A stretchable substrate with a polyimide material-based flexible substrate featuring a circuit pattern and Z-shaped wiring pattern that extends in two different directions, connected via mounting pad parts, and a hollow part created by cutting along the outer circumferential line, allowing for enhanced flexibility and tensile strength.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If electronic parts are directly attached to the polymer substrate using solder, then electrical connection is achieved, but cracking or separation occurs when the substrate is bent or curved
Solution Approach 1:
The patent introduces a separate wiring substrate as an intermediary layer between the polymer substrate and electronic parts. This wiring substrate absorbs bending stresses through its flexible wiring patterns, preventing direct stress transmission to the solder joints and electronic parts, thereby maintaining bonding strength and electrical connection reliability during flexing
2Adaptability or versatility
If metal line wiring is attached to clothes by sewing with thread, then stretchability is achieved, but the process becomes complicated and costly
Solution Approach 1:
The patent employs a flexible wiring substrate with patterned wiring lines that can be manufactured using standard PCB fabrication processes. This approach provides the necessary stretchability and flexibility through the substrate material and wiring geometry, while avoiding complex sewing operations and enabling mass production through conventional manufacturing techniques
3Ease of manufacture
If a conventional flat polymer substrate is used, then manufacturing is simple, but softness and flexibility are insufficient for wearable devices
Solution Approach 1:
The patent creates a composite structure combining a polymer substrate with a flexible wiring substrate. This composite design integrates the manufacturing simplicity of polymer processing with the enhanced softness and flexibility of specialized flexible PCB materials, achieving both ease of manufacture and adaptability for wearable applications
Data Source
AI summary
A stretchable substrate and a manufacturing method of the stretchable substrate are disclosed. In a step of manufacturing a flexible substrate, a circuit pattern composed of one or more mounting pad parts configured to cause electronic parts to be mounted to a polyimide film PI having a fixed size is formed, and a wiring pattern configured to circuit-connect the mounting pad parts is formed, and further an outer circumferential line of the circuit pattern is realized in a cutting line for cutting. In a step of mounting parts, the electronic parts are mounted on the circuit pattern of the flexible substrate. In a punching step for cutting the cutting line, a punching jig set to be aligned to the cutting line of the flexible substrate on which the parts are mounted is utilized, thereby realizing the excellent tensile performance of wiring configured to connect a circuit.