Multilayer Substrate Structural Tuning Element for Deformation Control
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Solution Overview
Problem
Existing multilayer structures face challenges during processing and manufacturing due to deformation-induced forces, leading to damage or detachment of electronic and mechanical components, particularly when subjected to thermal expansion mismatches and complex shape formations.
Innovation Solution
An integrated functional multilayer structure with a substrate film and a structural tuning element that controls deformation by distributing deforming forces, using materials like conductive or insulating ink, and configuring the tuning element to limit or redirect deformation, thereby protecting components from damage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If the substrate is subjected to deformation during processing to achieve complex 3D shapes, then the design flexibility and integration capability are improved, but the electronic and mechanical components may break or detach due to deformation-induced forces
Solution Approach 1:
The patent introduces support structures that segment the substrate into regions with different mechanical properties. These support structures are positioned beneath components to provide localized reinforcement during deformation processes, allowing the overall substrate to achieve complex 3D shapes while protecting specific component areas from excessive stress.
Solution Approach 2:
The support structures act as intermediary elements between the deforming substrate and the sensitive components. They mediate the deformation forces by providing a mechanical buffer that distributes stresses away from the components, enabling the substrate to undergo necessary shape changes without compromising component integrity.
2Strength
If elements are directly embedded in hard resins to protect them, then the structural protection is improved, but the structure may tear apart due to CTE mismatch during temperature changes
Solution Approach 1:
The patent applies local quality by providing support structures with specific mechanical and thermal properties at locations beneath components, while the rest of the substrate maintains its original characteristics. This localized reinforcement allows differential thermal expansion to occur without causing structure-wide failure, as the support structures are strategically positioned to handle thermal stresses only where components are located.
Solution Approach 2:
The support structures function as composite elements combining materials with different CTE values to create a transition zone between the hard resin and the substrate. This composite approach allows the structure to accommodate thermal expansion mismatches by gradually transitioning between materials with different thermal properties, preventing sudden stress concentrations that would cause tearing.
3Adaptability or versatility
If the substrate is thermoformed to achieve desired 3D layout, then the integration of electronics and mechanical features is improved, but air may be trapped underneath components reducing contact area
Solution Approach 1:
The support structures are positioned beneath components before the thermoforming process begins. This preliminary placement ensures that when the substrate is deformed during thermoforming, the support structures are already in position to guide the deformation and prevent air from becoming trapped between the substrate and components, thereby ensuring proper contact area is maintained throughout the forming process.
Data Source
AI summary
A method of manufacture and an integrated functional multilayer structure, includes a substrate film formed or formable so as to exhibit a selected shape; and a number of functional, preferably including optical, mechanical, optoelectrical, electrical and/or specifically, electronic, elements, such as conductors, insulators, components and/or integrated circuits, provided upon the substrate film in the proximity of the shape; wherein the substrate film has further been provided with a structural tuning element, optionally including an elongated, circumferential or other selected shape, said structural tuning element being configured to locally control induced deformation, optionally including stretching, bending, compression and/or shearing, of the substrate film within said proximity of the shape.