Patterned Flexible Substrate Strain Relief for Stretchable Electronics
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Solution Overview
Problem
Current technologies for flexible and stretchable electronics face challenges in accommodating macroscopic strain without mechanical failure, as existing solutions either introduce manufacturing complexities or are prone to failure under deformation, and fail to support circuit complexities comparable to rigid and rigid-flex electronics.
Innovation Solution
A flexible and stretchable patterned substrate with strain-relief features, such as pores, slots, and areas of reduced thickness, allows for local strain domains lower than macroscopic strain, reducing stress and enabling the substrate to accommodate large deformations while maintaining circuit integrity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If rigid printed circuit boards are used to support electronic components, then mechanical strength and stability are improved, but flexibility and stretchability are lost
Solution Approach 1:
The patent replaces rigid printed circuit boards with flexible substrates that can be stretched and deformed. The substrate is designed with a patterned conformation including strain relief features that allow the electronic device to conform to flexible surfaces while maintaining structural integrity and supporting electronic components.
Solution Approach 2:
The substrate is divided into multiple regions with different mechanical properties: strain relief regions that can deform and strain-permitting regions that maintain stability. This segmentation allows different parts of the substrate to perform different functions - some areas stretch while others maintain rigidity to support components.
2Adaptability or versatility
If flexible substrates are used to enable stretchability, then adaptability is improved, but mechanical strength and reliability under strain are reduced
Solution Approach 1:
The substrate is segmented into strain relief regions and strain-permitting regions. The strain relief regions are designed to deform and absorb mechanical stress, while the strain-permitting regions maintain structural integrity to support electronic components, preventing mechanical failure during stretching.
Solution Approach 2:
Different regions of the substrate are assigned different mechanical properties. The strain relief regions have higher flexibility and lower stiffness to accommodate deformation, while the strain-permitting regions have higher stiffness and strength to reliably support electronic components during stretching.
3Reliability
If strain relief features are added to the substrate, then local strain is reduced protecting components, but manufacturing complexity increases
Solution Approach 1:
The strain relief features are implemented as a porous or patterned structure within the substrate. This porous design allows the substrate to deform in a controlled manner, creating low strain domains that protect electronic components while maintaining overall substrate integrity and avoiding excessive complexity.
4Manufacturing precision
If conventional rigid manufacturing processes are used, then manufacturing precision is maintained, but flexibility and conformability of the final device are lost
Solution Approach 1:
The patent uses flexible substrates that can be manufactured using conventional rigid PCB techniques, then stretched and deformed after manufacturing. This allows precise circuit fabrication on flexible material, combining manufacturing precision with device conformability.
Solution Approach 2:
The substrate is manufactured in a relaxed state with precise circuits using conventional processes, then stretched and deformed after manufacturing to achieve the final flexible configuration. This preliminary manufacturing approach ensures precision is maintained while enabling subsequent flexibility.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The substrate design enables the creation of flexible and conformable devices that can withstand significant macroscopic strain without compromising circuit performance, facilitating the integration of electronic components and interconnects while being compatible with conventional industrial manufacturing processes.
Implementation Method 1
A flexible and stretchable patterned substrate with strain-relief features, such as pores, slots, and areas of reduced thickness, allows for local strain domains lower than macroscopic strain
Data Source
AI summary
A flexible and stretchable patterned substrate is provided having a strain-permitting material comprising a patterned conformation that allows the flexible patterned substrate to experience local strain or local strain domains lower than the macroscopic strain of the flexible and stretchable patterned substrate.