Fabricating Stretchable Circuits via Conformal Wiring on Patterned Polymer
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Solution Overview
Problem
Current methods for fabricating stretchable electronic circuits are limited by high fabrication costs due to the need for separate formation of device and wiring regions on flexible substrates, which do not allow for a continuous semiconductor process.
Innovation Solution
A method involving the preparation of a substrate with alternating concave and convex surfaces for both device and wiring regions, where a polymer film is patterned and metal wiring is conformally formed to connect electronic devices across these surfaces, allowing for a continuous process that reduces costs and improves reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If separate formation of device region and wiring region is used on flexible substrates, then flexibility is maintained, but fabrication cost increases and process complexity increases
Solution Approach 1:
The patent merges the formation of device region and wiring region into a single continuous semiconductor process on a rigid substrate. The polymer film serves as a common insulating layer for both regions, and both regions are formed simultaneously through sequential deposition and patterning steps, eliminating the need for separate formation processes and reducing overall process complexity.
Solution Approach 2:
The patent segments the substrate into distinct device region and wiring region areas on a rigid substrate. The polymer film is selectively patterned to provide insulation in the device region while allowing metal wiring formation in the wiring region, enabling separate functional areas to be created within a unified continuous process framework.
2Productivity
If separate formation of device region and wiring region is used, then flexibility is maintained, but fabrication time increases
Solution Approach 1:
The patent implements a continuous semiconductor fabrication process where the formation of device region and wiring region occurs without interruption on a rigid substrate. The process flows continuously from polymer film deposition through patterning to metal wiring formation, eliminating idle time between separate formation operations and improving overall fabrication throughput.
3Reliability
If metal wiring is conformally formed on alternating concave and convex surfaces, then electrical connection reliability improves, but manufacturing complexity increases
Solution Approach 1:
The patent employs alternating concave and convex surfaces in the wiring region to create a three-dimensional topography. Metal wiring is conformally deposited over these curved surfaces, ensuring continuous electrical connection while accommodating the flexible substrate's deformation. The curved surfaces distribute stress and prevent cracking in the metal wiring layer during bending or stretching.
4Manufacturing precision
If polymer film is patterned to form polymer pattern, then device region definition improves, but process steps increase
Solution Approach 1:
The patent performs preliminary patterning of the polymer film to define the device region before metal wiring formation. The polymer pattern serves as a pre-established boundary that guides subsequent metal deposition and wiring formation, ensuring precise device region definition while allowing the rest of the process to proceed in a streamlined manner.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach simplifies the fabrication process, reduces costs, and enhances the reliability of stretchable electronic circuits by enabling the formation of electronic devices and wiring regions in a single, continuous semiconductor process, suitable for applications like sensor skins and wearable devices.
Implementation Method 1
performing a heat treatment process to cure the polymer pattern
Data Source
AI summary
Provided is a method of fabricating an electronic circuit. The method includes preparing a substrate, forming a polymer film on the substrate, patterning the polymer film to form a polymer pattern, and forming an electronic device on the polymer pattern.