Optical Assembly Connection Substrate Rigidity Reduction
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional optical image stabilizers face interference from connection substrates when the camera module moves, as these substrates hinder the movement due to their rigidity, affecting the image quality by not allowing sufficient flexibility during hand-shake compensation.
Innovation Solution
An optical assembly with a connection substrate that includes rigidity reduction portions, such as slits, to reduce distortion and warpage, allowing the substrate to move flexibly with the camera module during pivotal rotation and translation motion, thereby minimizing interference with the camera module's movement.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a connection substrate is used to electrically connect the camera module to external entities, then electrical connection is achieved, but the substrate hinders the movement of the camera module due to its rigidity
Solution Approach 1:
The connection substrate is divided into multiple sections: a first section disposed around the hinge portion and a second section extending outwardly. This segmentation allows different portions of the substrate to have different rigidity characteristics, enabling both reliable electrical connection and flexible movement accommodation.
Solution Approach 2:
The connection substrate has non-uniform rigidity distribution with a rigidity reduction portion specifically located in the second section. This local quality change allows the substrate to be rigid where needed for electrical connection and flexible where needed for movement, resolving the contradiction between connection reliability and movement flexibility.
2Stability of the object's composition
If the connection substrate is made rigid to maintain structural stability, then connection stability is improved, but distortion or warpage occurs during camera module movement
Solution Approach 1:
The connection substrate features a rigidity reduction portion with reduced rigidity specifically in the second section where distortion occurs during movement. This local quality modification allows the substrate to maintain overall stability while accommodating movement-induced deformation in critical areas, preventing warpage.
Solution Approach 2:
The rigidity reduction portion enables the connection substrate to dynamically adjust its stiffness characteristics during operation. The substrate can be rigid when stable connection is needed and flexible when movement occurs, adapting its mechanical properties to match operational requirements and prevent distortion.
Data Source
AI summary
An optical assembly includes: a camera module; at least one actuator configured to move the camera module; and a connection substrate having one end connected to the camera module such that at least a portion of the connection substrate is configured to move along with movement of the camera module. The connection substrate includes a rigidity reduction portion reducing rigidity of the connection substrate in a portion of the substrate in which distortion or warpage occurs according to the movement of the camera module.