Flexible Printed Circuit Reinforcing Structures for Impact Strength
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Solution Overview
Problem
Flexible printed circuits in displaying devices face challenges with impact strength, particularly in areas away from bonding regions, leading to potential tears during assembly and operation, and require precise operator skills to avoid breakage of gold fingers.
Innovation Solution
A flexible printed circuit design featuring a flexible substrate with specific wiring and reinforcing structures, including net-like reinforcing layers in strategic areas, and strategically placed gold fingers, to enhance impact strength and reduce stress on bonding areas, along with a manufacturing method that forms signal wirings and reinforcing structures on the substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If the flexible printed circuit is made flexible for bending and connection, then the adaptability and ease of operation are improved, but the impact strength and reliability deteriorate, leading to potential tears and gold finger breakage
Solution Approach 1:
The flexible substrate is divided into multiple wiring areas (first, second, third, fourth wiring areas) with different functional requirements. Reinforcing structures are selectively placed in specific wiring areas (second and fourth) that require higher impact strength, while other areas maintain flexibility for bending and connection.
Solution Approach 2:
Different regions of the flexible substrate are given different structural properties. The second and fourth wiring areas incorporate reinforcing structures to enhance impact strength locally, while the first and third wiring areas maintain the original flexible characteristics for bending and connection purposes.
2Reliability
If reinforcing structures are added to improve impact strength, then the reliability is improved, but the device complexity and manufacturing difficulty increase
Solution Approach 1:
Reinforcing structures are applied locally only in the second and fourth wiring areas where impact strength is critical, rather than uniformly across the entire flexible substrate. This selective reinforcement minimizes added complexity while providing necessary strength enhancement.
Solution Approach 2:
Instead of reinforcing the entire flexible substrate, the invention applies reinforcing structures partially only in specific wiring areas (second and fourth) where the need for impact strength is greatest, achieving sufficient reliability without excessive structural complexity.
Data Source
AI summary
A flexible printed circuit and manufacturing method thereof, and a displaying device. A wiring layer is arranged on a flexible substrate, a reinforcing layer is arranged on a side of the flexible substrate away from the wiring layer, the wiring layer comprises a plurality of signal wirings arranged along a first wiring area, a second wiring area, a third wiring area and a fourth wiring area, and the reinforcing layer comprises a first reinforcing structure located in the second wiring area and a second reinforcing structure located in the fourth wiring area. The impact strength of the flexible printed circuit is increased by arranging the first reinforcing structure in the second wiring area of the flexible substrate and arranging the second reinforcing structure in the fourth wiring area of the flexible substrate.