Flexible Electronics Assembly with Stress Channels
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current methods for forming flexible hybrid electronics (FHE) assemblies face challenges in effectively dissipating heat from high-power components, integrating electronics without mechanical stress failure, and are costly due to high manufacturing costs and material waste.
Innovation Solution
A flexible electronics assembly is designed with a substrate having dielectric layers, a cavity for electronics components, and stress channels through the substrate and ground planes to accommodate mechanical stress and improve heat dissipation, using subtractive and additive methods for formation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional rigid solder joints are used to attach electronics to FHE boards, then electrical connectivity is achieved, but the joints fail under mechanical stress from bending
Solution Approach 1:
The patent uses a flexible substrate with integrated ground planes and conductive traces that can bend and flex without breaking. The ground plane is patterned on the flexible substrate, allowing the entire assembly to conform to curved surfaces while maintaining electrical connectivity and mechanical integrity.
Solution Approach 2:
The invention employs a composite structure combining flexible substrate material with conductive ground plane traces. This composite design allows the ground plane to flex with the substrate, accommodating mechanical stress while maintaining electrical functionality.
2Ease of manufacture
If face-up or face-down attachment methods are used for electronics, then electronics can be mounted on FHE boards, but heat dissipation is insufficient
Solution Approach 1:
The patent transitions from planar 2D heat dissipation to 3D volumetric heat dissipation by creating a cavity within the flexible substrate. This cavity provides additional surface area and volume for heat sinking, allowing heat to dissipate in multiple directions rather than being constrained to a single plane.
Solution Approach 2:
The cavity structure creates a porous-like void space within the substrate that facilitates heat flow and dissipation. The cavity allows thermal energy to move through the substrate more effectively, improving overall heat management.
3Manufacturing precision
If chemical or physical deposition methods are used in clean rooms, then electronics can be fabricated, but manufacturing costs increase due to low deposition rates and high material waste
Solution Approach 1:
The flexible substrate with integrated ground planes can be fabricated using additive manufacturing techniques that do not require clean room environments. The structure is designed to be self-contained, with the ground plane and cavity integrated into the substrate itself, eliminating the need for separate fabrication steps in controlled environments.
4Adaptability or versatility
If stretchable adhesives and conductive inks are used to accommodate bending, then some flexibility is achieved, but the stretching limits are exceeded under significant mechanical stress
Solution Approach 1:
The patent uses a flexible substrate with integrated ground planes and conductive traces that can bend and flex without breaking. The ground plane is patterned on the flexible substrate, allowing the entire assembly to conform to curved surfaces while maintaining electrical connectivity and mechanical integrity.
Data Source
AI summary
A flexible electronics assembly including a substrate including one or more dielectrics. A cavity is formed within the substrate. A first ground plane is secured to the substrate. One or more stress channels are formed through one or more portions of the substrate and the first ground plane. An electronics component is disposed within the cavity.