Semi-Flexible PCB Thermal Modification for Steering Systems
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Solution Overview
Problem
The existing methods for producing semi-flexible printed circuit boards for motor vehicle steering systems require high effort and can be mechanically stressful, as they involve precise machining processes like milling, which can damage conductor tracks and lead to vibrations and mechanical stresses.
Innovation Solution
A method involving thermal modification of the carrier material in the connecting section by heating it to a forming temperature to reduce flexural rigidity, allowing for a more flexible connection between rigid printed circuit board sections, which can be bent or folded, using techniques such as embossing or laser processing to create a hinge-like connection without damaging the conductor tracks.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If milling is used to create furrows in the printed circuit board to produce a flexible connecting section, then the printed circuit board can be bent or folded to save space, but the manufacturing effort increases and mechanical stresses and vibrations occur that can damage conductor tracks
Solution Approach 1:
The patent replaces the mechanical milling process with a thermal modification process. Instead of using mechanical cutters to create furrows in the printed circuit board, the invention applies localized heat to specific regions of the board to create flexible connecting sections. This thermal approach eliminates the mechanical stresses and vibrations inherent in milling while achieving the same flexibility goal, thereby reducing manufacturing effort and preventing damage to conductor tracks.
Solution Approach 2:
The patent changes the physical state of the printed circuit board material through thermal modification. By heating specific regions to controlled temperatures, the material properties are altered to create flexible zones without mechanical removal of material. This parameter change approach (temperature control) replaces the mechanical parameter approach (milling depth and speed) and achieves flexibility with reduced manufacturing complexity.
2Volume of moving object
If milling is used to create furrows in the printed circuit board to produce a flexible connecting section, then the printed circuit board can be bent or folded to save space, but vibrations and mechanical stresses occur that can damage conductor tracks
Solution Approach 1:
The patent replaces the mechanical milling process with a thermal modification process. Instead of using mechanical cutters to create furrows in the printed circuit board, the invention applies localized heat to specific regions of the board to create flexible connecting sections. This thermal approach eliminates the mechanical stresses and vibrations inherent in milling while achieving the same flexibility goal, thereby reducing manufacturing effort and preventing damage to conductor tracks.
3Ease of operation
If precise depth milling is used to create flexible elements, then the connecting section becomes flexible enough for folding, but the manufacturing process becomes complex and time-consuming
Solution Approach 1:
The patent replaces the mechanical milling process with a thermal modification process. Instead of using mechanical cutters to create furrows in the printed circuit board, the invention applies localized heat to specific regions of the board to create flexible connecting sections. This thermal approach eliminates the mechanical stresses and vibrations inherent in milling while achieving the same flexibility goal, thereby reducing manufacturing effort and preventing damage to conductor tracks.
Solution Approach 2:
The patent utilizes thermal phase transitions in the printed circuit board material to create flexible zones. By heating the material to specific temperatures, the polymer matrix undergoes softening or phase changes that allow for controlled flexibility without mechanical removal of material. This phase transition approach is more efficient than progressive milling and achieves the desired flexibility in a single or few heating steps rather than multiple precision milling operations.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces manufacturing effort and mechanical stress, ensuring a reliable and compact production process with lower energy input, while maintaining the integrity of the conductor tracks and allowing for precise angular positioning of the printed circuit board sections.
Implementation Method 1
a thermal modification is produced in the connecting section by at least sectionally heating the carrier material to a forming temperature in order to reduce the flexural rigidity
Implementation Method 2
the carrier material is thermally treated in the connecting section in order to produce a mechanical weakening which makes it possible to bend the relatively rigid printed circuit board sections together in a hinge-like manner
Data Source
Figure 1~3
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Figure 8~11
AI summary
The present invention relates to a method for manufacturing a control circuit (1) for a steering system (8) of a motor vehicle, comprising a semi-flexible printed circuit board (2) having an insulating substrate material with conductive traces (22) arranged thereon, which are connected to electrical components (3), wherein the printed circuit board (2) has at least two substantially rigid printed circuit board sections (23) which are connected to each other via a flexible connecting section (24). In order to enable improved manufacturing with less effort and greater reliability, the invention proposes that a thermal modification (25) be produced in the connecting section (24) by heating the substrate material at least partially to a forming temperature, thereby reducing the bending stiffness.