Digital Camera Module Holder for Reusable FPCB Assembly

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Solution Overview

Problem

The existing digital camera module assembly process is complex and wasteful due to the flexible nature of the flex printed circuit board (FPCB), which makes it difficult to replace the image sensor package without wasting the FPCB.

Innovation Solution

A digital camera module design featuring a holder, an image sensor chip package with conductive elements and a circuit board, where the conductive elements are securely connected to both the inner and outer pads, allowing for efficient assembly and potential replacement of the image sensor package without wasting the circuit board.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If the image sensor package is fixedly connected to the FPCB, then the assembly is stable, but the FPCB cannot be reused if the image sensor package is rejected during quality control

Engineering Contradiction:
Improveassembly stabilityVSAvoidFPCB waste
Core Design Contradiction:
ReliabilityVSLoss of substance

Solution Approach 1:

The patent divides the connection system into separate segments: the FPCB remains in the connector while the image sensor package connects through conductive elements that can be independently replaced. This segmentation allows the FPCB to be decoupled from the image sensor package, enabling reuse of the FPCB when the image sensor package is rejected during quality control.

Inventive Principle:
Principle #1Segmentation

2Adaptability or versatility

If the FPCB is used to connect the image sensor package, then the digital camera module can be fitted around other devices, but the flexible nature makes assembly complex

Engineering Contradiction:
Improvespace utilizationVSAvoidassembly complexity
Core Design Contradiction:
Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The patent introduces conductive elements as intermediary components between the image sensor package and the FPCB/connector. These conductive elements serve as a mediator that simplifies the connection process, allowing the FPCB to maintain its flexible routing capabilities while the conductive elements provide stable, standardized connection points that reduce assembly complexity.

Inventive Principle:
Principle #24Intermediary (Mediator)

3Reliability

If the image sensor package is rejected during quality control, then quality is maintained, but the entire assembly including FPCB must be discarded

Engineering Contradiction:
Improvequality controlVSAvoidmanufacturing efficiency
Core Design Contradiction:
ReliabilityVSProductivity

Solution Approach 1:

The patent segments the assembly into replaceable image sensor package and reusable FPCB components. When quality control rejects an image sensor package, only that specific component needs to be replaced while the FPCB and other components can be reused, significantly improving manufacturing efficiency and reducing waste.

Inventive Principle:
Principle #1Segmentation

4Reliability

If the FPCB is fixedly connected to the image sensor package, then the connection is stable, but replacement of the image sensor package is difficult

Engineering Contradiction:
Improveconnection stabilityVSAvoidcomponent replaceability
Core Design Contradiction:
ReliabilityVSEase of repair

Solution Approach 1:

The patent separates the FPCB connection function (in the connector) from the image sensor package mounting function (through conductive elements). This segmentation enables the image sensor package to be easily replaced by disconnecting the conductive elements, while the FPCB remains stable and fixed in the connector, achieving both connection stability and ease of repair.

Inventive Principle:
Principle #1Segmentation

Data Source

PatentUS7361880B2Digital camera module for detachably mounting with flex printed circuit board
Publication Date: 2008.04.22 RAYPRUS TECHNOLOGIES LTD
  • US7361880B2 patent drawing
  • US7361880B2 patent drawing
  • US7361880B2 patent drawing

AI summary

A digital camera module (100) includes a holder, an image sensor chip package (30), a number of conductive elements (24) and a circuit board (40). The holder defines a receiving portion. The holder is mounted on the image sensor chip package. The image sensor chip package has a number of outer pads. The outer pads are positioned in the receiving portion of the holder. The conductive elements are received in the receiving portion. One end of each of the conductive elements is connected to the inner pads, the other end of each of the conductive elements is connected to the circuit board.