Wafer-Level Camera Module Housing With Support Plates
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Solution Overview
Problem
Conventional camera module housings suffer from positional deviations, poor packaging precision, exposure of signal pick-up electrodes, alignment inaccuracies, and surface damage issues due to excessive spacing and tolerances, leading to cold solder joints, impact vulnerability, and inefficient adhesive curing in the assembly process.
Innovation Solution
A modified housing design with a quadrilateral frame formed by four side plates, four supporting plates in direct contact with the camera module, and four bottom plates fixed to the PCB, reducing spacing and improving assembly accuracy, while eliminating the need for paint and shielding elements, and allowing efficient UV adhesive curing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a conventional metal housing with openings and supporting legs is used, then the housing structure is simple and easy to manufacture, but great spacing in the Z direction causes positional deviations and poor packaging precision
Solution Approach 1:
The patent transitions from a conventional housing with supporting legs to a support plate structure that eliminates the Z-direction spacing issue. The support plate is positioned at the bottom of the housing cavity, providing direct support to the camera module in the Z direction, thereby eliminating the spacing problem that caused positional deviations and poor packaging precision.
2Ease of operation
If openings are provided in side plates for UV adhesive dispensing, then the housing is easy to assemble, but signal pick-up electrodes are exposed and vulnerable to impact
Solution Approach 1:
The patent removes the openings from the side plates, extracting the vulnerability of exposed electrodes while maintaining assembly capability through alternative means. The support plate structure provides both support and protection, eliminating the need for openings that would expose the electrodes to external impacts.
3Ease of operation
If great spacing is maintained between housing and camera module, then assembly is easier, but alignment accuracy between light through hole and lens deteriorates
Solution Approach 1:
The patent addresses the alignment issue by positioning the support plate at the bottom of the housing cavity, providing stable support in the Z direction. This eliminates the spacing problem that caused alignment inaccuracies between the light through hole and lens, while maintaining ease of assembly through the simplified support plate structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances assembly precision, reduces cold solder joint issues, increases impact resistance, improves alignment, and simplifies the assembly process, resulting in a more reliable and cost-effective camera module housing.
Implementation Method 1
allowing efficient UV adhesive curing
Data Source
AI summary
A housing for protecting a wafer-level camera module and fixing the wafer-level camera module to a printed circuit board (PCB) includes: four side plates, defining a quadrilateral frame; four supporting plates each fixed to a lower portion of an inner face of a corresponding one of the four side plates, each supporting plate having a top face supporting a portion of the camera module; and four bottom plates each fixed to a lower portion of an outer face of a corresponding one of the four side plates, each bottom plate having a bottom face fixed to the PCB. The housing is capable of addressing the issues of poor housing-PCB soldering, paint falling off and surface scratching and improving the efficiency in UV lamp-utilized UV adhesive curing.