Printed Circuit Assembling TRIZ Cases

An integrated digital shell merges faceplate and inner components to eliminate gluing steps while securing the plug via snap-fit retention.

A multilayer wiring board design featuring alternating insulation and conductive patterns with via conductors connecting layers.

Differentiating side surface formation timing resolves dicing precision constraints, enabling minimal distance between components and cut edges.

An extended shield cover seals frame openings and PCB side walls, blocking electromagnetic wave interference through segmentation.

A rigid second layer resists compression forces from a heated metallic element, preventing substrate warping and component damage during hotbar soldering.

Replacing lossy over-molds with a segmented cap structure creates an air space that preserves RF gain and protects high-frequency components.

Anisotropic conductive film mounts components on flexible substrates using a silica-reinforced adhesive layer with high shear storage modulus.

A thermoforming film bonds tightly to a supporting structure, enclosing flexible boards and electronic devices within a sealed protective layer.

A conductive connector links an inductor to a circuit board through a via hole, securing the electrical path without extending wires across the surface.

Additive printed sockets retain solder balls without reflow, improving signal integrity and reducing production costs.

Carrier frame expands power stage module footprint to mount passive components, reducing substrate costs for high current converters.

A flexible printed board uses a hollow copper foil pattern with a coverlay opening to expose the inner section for camera reading.

Segmenting bonding pressure from vacuum handling protects sensitive VCM actuators from acceleration damage while maintaining high assembly speed.

Support plates eliminate Z-direction spacing to fix positional deviations and enable efficient UV adhesive curing for wafer-level camera modules.

A connector penetrates a wireless charger shielding plate to electrically link the transmitter coil with circuit board components.

Folding a flexible circuit board reduces connection area while maintaining electrical stability and coupling ease.

A connection circuit board bridges first and second connection parts across an accommodating hole on a main circuit board body.

Gaps between resin and outer electrodes block strain transmission, reducing vibration and audible sound.

Electrolytic dissolution of bismuth in nitric acid followed by ion exchange removes polonium, reducing alpha dose to 0.003 cph/cm2 for semiconductor solder.

A component carrier uses segmented adhesive and solder depots to join flexible substrates while preserving material flexibility.

A hard disk drive base incorporates a protruding portion on the sidewall to expand the gasket contact area.

Transfer printing integrates single-crystalline silicon onto plastic substrates without high-temperature damage.

External electrodes extend from end surfaces to main surfaces of the ceramic body to shorten current paths and reduce equivalent series inductance.

A circuit board uses a partially removed copper oxide layer to expose underlying copper, enabling precise cream solder bump formation on the substrate.

A stand-off with a flange nests into a counter-bore to secure components on printed circuit boards.

Capillary forces from an evaporating liquid layer position and bind a micro device electrode to a substrate, simplifying the bonding process.

Embedding passive components in a substrate cavity reduces packaging height and shortens signal paths for better miniaturization.