Electronic Component Unit Side Surface Configuration for Size Reduction
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Solution Overview
Problem
Existing electronic component units mounted on substrates face limitations in size reduction due to uniform distance requirements between components and substrate side surfaces, which are determined by positional precision in dicing, leading to inefficiencies in minimizing the overall size of the component unit.
Innovation Solution
The electronic component unit design features a substrate with distinct first and second side surfaces, where the distance between the component and the first side surface can be minimized without the need for an extra allowance, allowing for reduced size by positioning the component closer to the first side surface, and the second side surface is formed post-component mounting with an allowance for precision, enabling smaller unit dimensions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the aggregate substrate is cut along the individual substrate regions into individual substrates by dicing processing, then the electronic component units can be efficiently manufactured, but a distance with extra allowance is required between the mounted components and cut surfaces due to positional precision variation in dicing
Solution Approach 1:
The invention applies preliminary action by forming the first side surface of the substrate before mounting the component. This allows the side surface to be precisely defined in advance, eliminating the need for extra allowance distance that would be required if the side surface were formed after component mounting due to dicing precision variations. The component is then mounted relative to this pre-formed side surface, enabling minimal distance while maintaining manufacturing efficiency.
2Manufacturing precision
If the distances between the side surfaces of the substrate and the component are determined by the positional precision in dicing, then the distances are uniform regardless of component size, but this limits the ability to reduce the size of the electronic component unit when component size is reduced
Solution Approach 1:
The invention applies local quality by differentiating between two side surfaces: the first side surface formed before component mounting with minimal distance to the component, and the second side surface formed after component mounting with extra allowance distance. This local differentiation allows the distance requirement to be optimized for each side surface based on its formation timing and functional requirements, enabling size reduction while maintaining necessary precision.
Solution Approach 2:
The invention segments the side surfaces into two distinct types with different distance requirements. The first side surface (formed before mounting) has a different distance characteristic from the second side surface (formed after mounting). This segmentation allows independent optimization of each side surface's distance to the component, breaking the uniform distance constraint and enabling smaller component unit sizes.
Data Source
AI summary
An electronic component unit includes a substrate including principal surfaces opposing each other and side surfaces between the principal surfaces, and components mounted on the principal surface of the substrate. The side surfaces include first side surfaces formed before the components are mounted and second side surfaces formed after the components are mounted. As viewed from a line normal to the principal surface of the substrate, distances between the first side surfaces and the components are different from distances between the second side surfaces and the components.