Liquid-Assisted Binding for Micro Device Electrode Attachment
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The challenge in commercializing micro devices lies in the complex process of bonding them to a substrate, particularly in achieving a reliable and efficient transfer process.
Innovation Solution
A method of liquid-assisted binding is employed, where a conductive pad is formed on the substrate, a micro device is placed on it, a liquid layer is formed to grip the device with capillary forces, and then evaporated to secure the electrode to the pad, establishing an electrical connection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional bonding methods are used to bond micro devices to substrates, then bonding can be achieved, but the process becomes complex and reliability is compromised
Solution Approach 1:
The patent utilizes the phase transition of liquid from liquid state to vapor state through evaporation. The liquid layer is applied in liquid form to provide capillary gripping force for precise positioning, then evaporated to leave behind a bonded structure, simplifying the bonding process while improving reliability
Solution Approach 2:
The patent introduces a liquid layer as an intermediary substance between the micro device and substrate. This liquid layer provides capillary forces during bonding and evaporates completely, leaving no residue. The intermediary liquid enables reliable bonding through controlled phase change while maintaining process simplicity
2Manufacturing precision
If precise positioning is achieved during bonding, then attachment accuracy improves, but the bonding process becomes more complex
Solution Approach 1:
The patent employs capillary forces generated by the liquid layer to achieve precise positioning and gripping of the micro device. The capillary action naturally draws the liquid into the interface between the micro device and substrate, providing self-aligning forces that simplify the positioning process while achieving high precision
Solution Approach 2:
The liquid layer provides self-gripping through capillary forces and self-positioning during the bonding process. The system uses the inherent properties of the liquid (surface tension, capillary action) to automatically achieve precise positioning without requiring complex external positioning mechanisms, thereby improving precision while maintaining process simplicity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method effectively binds the micro device to the substrate, ensuring precise positioning and firm attachment while maintaining electrical connectivity, enhancing the commercial viability of micro devices.
Implementation Method 1
a part of the liquid layer penetrates between the micro device and the conductive pad, and the micro device is gripped by a capillary force produced by said part of the liquid layer
Implementation Method 2
evaporating the liquid layer such that the electrode is bound to the conductive pad and is in electrical connection with the conductive pad
Data Source
AI summary
A method of liquid assisted binding is provided. The method includes: forming a conductive pad on the substrate; placing a micro device on the conductive pad, such that the micro device is in contact with the conductive pad in which the micro device comprises an electrode facing the conductive pad; forming a liquid layer on the micro device and the substrate after said placing, such that a part of the liquid layer penetrates between the micro device and the conductive pad, and the micro device is gripped by a capillary force produced by said part of the liquid layer; and evaporating the liquid layer such that the electrode is bound to the conductive pad and is in electrical connection with the conductive pad.