Embedded Passive Component in Packaging Substrate
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Solution Overview
Problem
Conventional packaging substrates with surface-mounted passive components increase the height of the structure, lead to longer signal transmission paths, and limit the area available for mounting, adversely affecting electrical performance and product miniaturization.
Innovation Solution
A packaging substrate with an embedded passive component, featuring a core board with a cavity, a dielectric layer unit, positioning pads or solder bumps, and conductive vias to connect the passive component to wiring layers, reducing the overall height and signal transmission path while allowing more components to be integrated.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If passive components are mounted on the outer surface of the substrate, then the components can be easily installed, but the height of the overall packaging structure increases
Solution Approach 1:
The passive component is embedded within a cavity formed in the substrate, with the cavity filled by a molding compound. This nesting approach places the component inside the substrate structure rather than on the surface, reducing the overall packaging height while maintaining installation feasibility through the embedding process
2Ease of operation
If passive components are mounted on the outer surface of the substrate, then the components can be easily accessed, but the signal transmission path between inner circuit and passive component becomes long
Solution Approach 1:
By nesting the passive component within a cavity in the substrate, the component is positioned much closer to the inner circuit traces. This eliminates the need for long external connections and reduces the signal transmission path to minimal trace lengths within the substrate itself
3Reliability
If conductive traces are disposed on the surface of the substrate, then electrical connections can be established, but the area available for mounting passive components is limited
Solution Approach 1:
The solution transitions from two-dimensional surface mounting to three-dimensional embedding. By utilizing the vertical dimension and creating a cavity within the substrate thickness, the mounting area is effectively expanded without occupying additional surface area, allowing passive components to be positioned within the substrate volume rather than competing for surface space
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The embedded passive component design reduces the packaging height, shortens signal transmission paths, and enables increased component density without compromising wiring layout, enhancing electrical performance and miniaturization of electronic products.
Implementation Method 1
a dielectric layer unit having an upper surface and a lower surface, and encapsulating the core board and filling the cavity of the core board
Implementation Method 2
a first wiring layer disposed on the upper surface of the dielectric layer unit and electrically connected to the electrode pads of the upper surface of the passive component through a plurality of first conductive vias
Data Source
AI summary
A packaging substrate includes: a core board with at least a cavity; a dielectric layer unit having upper and lower surfaces and encapsulating the core board and filling the cavity; a plurality of positioning pads embedded in the lower surface of the dielectric layer unit; at least a passive component having upper and lower surfaces with electrode pads disposed thereon and embedded in the dielectric layer unit so as to be received in the cavity of the core board at a position corresponding to the positioning pads; first and second wiring layers disposed on the upper and lower surfaces of the dielectric layer unit and electrically connected to the electrode pads of the upper and lower surfaces of the passive component through conductive vias, respectively. By embedding the passive component in the core board and the dielectric layer unit, the invention effectively reduces the height of the overall structure.