Embedded Capacitor Substrate Vibration Damping via Resin Gaps

Solution Overview

Problem

Built-in-electronic-component substrates with embedded multilayer ceramic capacitors experience vibration and acoustic noise due to strain generated by applied voltage, which can lead to erroneous operation of acceleration sensors and increased audible sound.

Innovation Solution

Incorporating gaps and insertion members with lower elasticity between the resin layer and the electronic component's outer electrodes and body, which absorb and block strain transmission, reducing vibration and audible sound generation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Volume of moving object

If multilayer ceramic capacitors are embedded in resin layer, then substrate thickness is reduced and lightweight is achieved, but vibration and acoustic noise increase due to strain transmission

Engineering Contradiction:

Improvesubstrate thicknessVSAvoidvibration and acoustic noise

Core Design Contradiction:

Volume of moving objectVSObject-generated harmful factors

Solution Approach 1:

The patent introduces an intermediary substance (resin layer with specific viscoelastic properties) between the multilayer ceramic capacitor and the substrate. This resin layer acts as a mediator that absorbs and dissipates the strain energy generated by the capacitor, preventing vibration transmission to the substrate while maintaining the embedded configuration for thickness reduction.

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The patent modifies the physical parameters of the resin layer, specifically its viscosity and elasticity characteristics, to optimize its strain absorption capability. By controlling the resin's viscoelastic properties, the system achieves effective vibration damping while maintaining the compact embedded structure.

Inventive Principle:

Principle #35Parameter changes

2Ease of manufacture

If resin layer directly contacts electronic component, then manufacturing is simplified, but strain is transmitted to substrate causing vibration

Engineering Contradiction:

Improvemanufacturing process simplicityVSAvoidstrain transmission

Core Design Contradiction:

Ease of manufactureVSObject-generated harmful factors

Solution Approach 1:

The patent modifies the physical parameters of the resin layer, specifically its viscosity and elasticity characteristics, to optimize its strain absorption capability. By controlling the resin's viscoelastic properties, the system achieves effective vibration damping while maintaining the compact embedded structure.

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

The patent employs a composite material system consisting of the resin layer with specific viscoelastic properties that combines the benefits of direct contact (manufacturing simplicity) with strain absorption capabilities. The composite nature of the resin formulation enables both ease of application and effective vibration damping.

Inventive Principle:

Principle #40Composite materials

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Significantly reduces vibration and audible sound caused by strain, while improving moisture resistance and rigidity of the substrate.

Implementation Method 1

When a voltage is applied to the multilayer ceramic capacitor 201 including the ceramic multilayer body 202, a strain is generated in the ceramic multilayer body 202 in accordance with the size of the applied voltage due to the electrostrictive effect and the inverse piezoelectric effect.

Methodology Applied

Scientific EffectElectrostrictive effect: Electrostriction

Implementation Method 2

When a voltage is applied to the multilayer ceramic capacitor 201 including the ceramic multilayer body 202, a strain is generated in the ceramic multilayer body 202 in accordance with the size of the applied voltage due to the electrostrictive effect and the inverse piezoelectric effect.

Methodology Applied

Scientific EffectInverse piezoelectric effect: Piezoelectric Effect

Implementation Method 3

Incorporating gaps and insertion members with lower elasticity between the resin layer and the electronic component's outer electrodes and body, which absorb and block strain transmission, reducing vibration and audible sound generation.

Methodology Applied

Scientific EffectVibration absorption: Damping

Data Source

PatentUS9961775B2Built-in-electronic-component substrate and manufacturing method therefor

Publication Date: 2018.05.01 MURATA MFG CO LTD

AI summary

A built-in-electronic-component substrate includes a core substrate, an electronic component mounted on one main surface of the core substrate via a joining member, and a resin layer including the electronic component embedded therein. The electronic component is a multilayer ceramic capacitor including a ceramic multilayer body, and a first outer electrode including an end surface portion and a second outer electrode including an end surface portion provided on end surfaces of the ceramic multilayer body. A first gap is provided between the resin layer and the end surface portion of the first outer electrode and the joining member and a second gap is provided between the resin layer and the end surface portion of the second outer electrode and the joining member.