Power Stage Device with Carrier Frame for Integrated Inductor
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Solution Overview
Problem
Higher current converters, such as point-of-use and point-of-load converters, face a cost issue due to the large size of the output inductor, which necessitates an expensive module substrate to accommodate it, increasing overall device costs without additional benefits.
Innovation Solution
A power device design that integrates a passive component, like an inductor, with a power stage module using a frame with a lower interconnect density, allowing for a cost-effective expansion of the module's footprint using less expensive electrically insulative materials, while maintaining efficient electrical connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If the module substrate size is increased to accommodate a large inductor, then the inductor can be integrated with the power stage module, but the overall device cost significantly increases
Solution Approach 1:
The patent divides the mounting substrate into two distinct parts: a power stage module substrate with high interconnect density for the power stage components, and a separate frame substrate with lower interconnect density for mounting the inductor. This segmentation allows each substrate to be optimized independently, enabling inductor integration without requiring the entire power stage module substrate to be enlarged and expensive.
2Reliability
If the module substrate interconnect density is increased to provide electrical connections for the power stage module, then the power stage module can be properly connected, but the substrate cost increases
Solution Approach 1:
The patent applies different interconnect density characteristics to different regions of the mounting substrate. The power stage module substrate portion has high interconnect density with small pitches to support the electrical connections required by the power stage module, while the frame portion has lower interconnect density since it only needs to provide structural support and limited electrical connections for the inductor. This local differentiation reduces overall substrate cost while maintaining necessary connection quality.
Data Source
AI summary
A power device includes a frame having an electrically insulative material, an opening in the electrically insulative material, and an electrical conductor extending through the electrically insulative material. A power stage module fixed in the opening has an output terminal at a first side of the power stage module, and a power terminal, a ground terminal and a plurality of input/output (I/O) terminals at a second side of the power stage module opposite the first side. A passive component has a first terminal attached to the output terminal of the power stage module and a second terminal attached to the electrical conductor of the frame. The passive component has a larger footprint than the power stage module. The frame expands the footprint of the power stage module to accommodate mounting of the passive component to the power device. The frame has a lower interconnect density than the power stage module.