Embedded Multilayer Ceramic Part Electrode Design for ESL Reduction
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Solution Overview
Problem
The challenge in manufacturing printed circuit boards with embedded multilayer ceramic electronic parts is the high manufacturing cost and reliability issues due to the separate copper plating layer, which affects the depth adjustment of via holes during laser processing and increases interconnect inductance, while existing methods fail to adequately improve equivalent series inductance (ESL) characteristics.
Innovation Solution
A multilayer ceramic electronic part design with external electrodes extending from end surfaces to main and side surfaces, where the length and thickness of these electrodes are optimized to ensure reliable electrical connectivity and minimize plating solution permeation, using copper or other metals with a glass component, and forming a copper metal layer to improve electrical connectivity and reduce ESL.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a separate copper plating layer is formed on the external electrode, then electrical connectivity is improved, but manufacturing cost increases and plating solution permeation causes reliability issues
Solution Approach 1:
The patent combines the external electrode and copper plating layer into a single integrated structure. The external electrode itself is formed of copper as a main component, eliminating the need for a separate plating layer while maintaining electrical connectivity and reducing manufacturing complexity
2Reliability
If a separate copper plating layer is formed on the external electrode, then electrical connectivity is improved, but plating solution permeation occurs causing reliability problems
Solution Approach 1:
By integrating the copper plating function directly into the external electrode structure, the patent eliminates the interface between separate layers that would allow plating solution permeation. The external electrode is formed as a monolithic copper-based structure, preventing harmful fluid penetration
3Ease of manufacture
If the external electrode includes glass component for laser processing, then via hole formation is enabled, but depth adjustment becomes difficult due to laser absorption
Solution Approach 1:
The patent optimizes the glass component content and composition in the external electrode to control laser absorption characteristics. By adjusting the glass content within specific ranges and modifying the glass composition, the patent enables effective via hole formation while maintaining controllable depth during laser processing
4Volume of moving object
If embedded multilayer ceramic electronic part is used, then product size is decreased, but interconnect inductance and ESL characteristics are not sufficiently improved
Solution Approach 1:
The patent extends the external electrode from the end surfaces to the main surfaces of the ceramic body, creating a three-dimensional electrode configuration. This dimensional extension provides multiple electrical connection paths and reduces the effective current path length, thereby decreasing interconnect inductance and improving ESL characteristics while maintaining the compact embedded structure
Data Source
AI summary
A multilayer ceramic electronic part to be embedded in a board includes a ceramic body including dielectric layers and having main surfaces, side surfaces, and end surfaces; first and second internal electrodes including first and second leads exposed to the main surfaces; and first and second external electrodes formed on the end surfaces and extending to the main surfaces, wherein when a length from one of ends of the first or second external electrode formed on the main surfaces to a point at which the first or second external electrode contacts the first and second leads is G, a length from one of the ends of the first or second external electrode to the end surfaces is BW, and a length from the end surfaces to a point at which the first or second external electrode contacts the first and second leads is M, 30 μm≦G<BM−M is satisfied.