Out-Mold Packaging for Waterproof Electronic Devices
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Solution Overview
Problem
Current methods for manufacturing waterproof and dust-proof electronic products, such as using rubber strips between plastic casings or in-mold electronics, either fail to achieve a 100% waterproof effect or result in low yield rates and potential damage to electronic devices due to collision with injected plastics.
Innovation Solution
The out-mold packaging technology involves a supporting structure, a flexible board with an electronic device, and a covering layer comprising a thermoforming film and function films, which are tightly bonded using heating and pressurization in a vacuum environment to prevent damage and ensure waterproof and dust-proof protection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If in-mold electronic technology is used to achieve waterproof effect, then waterproof performance is improved, but yield rate decreases and electronic devices may be damaged by injected plastics
Solution Approach 1:
Instead of injecting plastic around the electronic device (in-mold), this patent inverts the process by placing the electronic device outside the mold cavity and bonding a pre-formed plastic housing to it (out-mold). This reversal eliminates the risk of injected plastic damaging the device while maintaining waterproof sealing through the bonding process.
Solution Approach 2:
The plastic housing is pre-formed and prepared before the electronic device is placed outside the mold. This preliminary preparation of the housing allows for precise fitting and bonding without exposing the electronic device to the high-pressure injection process, thereby improving yield rate while maintaining waterproof performance.
2Reliability
If in-mold electronic technology is used to achieve waterproof effect, then waterproof performance is improved, but electronic devices may be collided and damaged by injected plastics
Solution Approach 1:
The patent inverts the traditional in-mold process by placing the electronic device outside the mold cavity and bonding a pre-formed housing to it. This inversion completely eliminates the collision risk between injected plastics and the electronic device, preserving device integrity while achieving waterproof sealing through the bonding interface.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method increases the yield rate of electronic product packaging, avoids damage from injected plastics, and provides effective waterproof and dust-proof protection while allowing for complex 3D curved surfaces and additional functions like heat dissipation and decoration.
Implementation Method 1
the thermoforming film is heated and deformed
Implementation Method 2
the thermoforming film is heated and deformed, such that the shapes of the flexible board and the covering layer conform to the shape of the supporting structure
Data Source
AI summary
A packaging structure and a packaging method of an electronic product are disclosed. The packaging structure of an electronic product includes a supporting structure, a flexible board and a covering layer. The supporting structure has a shape. The flexible board is stacked on the supporting structure, and has an electronic device disposed thereon. The covering layer is attached on the stacked supporting structure and flexible board and covering the electronic device. The shapes of the flexible board and the covering layer conform to the shape of the supporting structure, and the flexible board and the electronic device are tightly interposed between the covering layer and the supporting structure. The covering layer includes a thermoforming film and at least a function film stacked on the thermoforming film.