Multilayer Wiring Board Design for High-Density Interconnects
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Solution Overview
Problem
As IC chips become finer and more integrated, the increasing number of pads on package substrates leads to narrower wiring pitches, posing challenges in manufacturing high-density wiring boards with sufficient electrical connectivity and reliability.
Innovation Solution
A multilayer wiring board design featuring alternating layers of insulation and conductive patterns, with via conductors connecting conductive patterns across layers, allowing for high-density signal transmission between semiconductor elements while maintaining structural integrity and reducing stress sensitivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If the number of pads is increased to accommodate finer IC chips, then the wiring density is improved, but the manufacturing precision becomes more difficult to maintain
Solution Approach 1:
The wiring board is divided into multiple layers with alternating insulation and conductive pattern layers. This segmentation allows the wiring structure to be built incrementally, with each layer contributing to the overall high-density wiring while maintaining manufacturability through standardized layering processes.
Solution Approach 2:
The patent transitions from planar wiring to three-dimensional multilayer wiring by stacking conductive patterns separated by insulation layers. Via conductors connect corresponding patterns across layers, enabling high-density interconnection in the vertical dimension while maintaining controlled wiring pitches within each layer.
2Quantity of substance
If the wiring pitch is narrowed to increase wiring density, then the signal transmission capability is improved, but the reliability decreases due to stress sensitivity
Solution Approach 1:
The wiring board employs composite structure combining multiple insulation materials with different properties. The first and second insulation layers use different materials that complement each other, providing both mechanical strength and stress resistance. This composite approach allows narrow wiring pitches while maintaining reliability through balanced stress distribution.
Solution Approach 2:
Different regions of the wiring board can use different insulation material compositions tailored to local requirements. High-stress areas with narrow wiring pitches can benefit from insulation materials optimized for stress resistance, while other areas can prioritize other properties such as dielectric performance or manufacturability.
3Productivity
If high-density wiring is implemented, then the signal transmission efficiency is improved, but the device complexity increases
Solution Approach 1:
Each insulation layer serves multiple functions: electrical isolation between conductive patterns, mechanical support for the wiring structure, and stress management through material selection. The via conductors simultaneously provide electrical connection and structural alignment features. This multi-functionality reduces the need for additional specialized components, managing complexity while achieving high-density interconnection.
Data Source
AI summary
A wiring board includes a first insulation layer, a second insulation layer formed on the first insulation layer, a wiring structure interposed between the first insulation layer and the second insulation layer and including an insulation layer and conductive patterns formed on the insulation layer, second conductive patterns formed on the second insulation layer, and a via conductor formed through the second insulation layer and connected to one of the second conductive patterns on the second insulation layer.