Component Carrier with Adhesive and Solder Depots for Flexible Substrates
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Solution Overview
Problem
The connection of electronic components with flexible substrates, such as textiles, for intelligent textiles or smart fabrics, faces challenges in achieving reliable electrical and mechanical connections that withstand washing processes and are suitable for various textile materials and geometries, while existing methods are complex and costly.
Innovation Solution
A component carrier with a surface partially covered in adhesive and featuring solder depots, which allows for both electrical and mechanical connections to flexible substrates through thermally conductive channels, enabling robust and durable attachment without impairing the substrate's flexibility.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If soldering is used to create mechanical adhesive connection, then mechanical connection is improved, but the substrate partially melts and the process becomes complex
Solution Approach 1:
The connection function is segmented into two distinct parts: solder depots for electrical connection and adhesive areas for mechanical connection. This segmentation allows each part to perform its specific function optimally without interfering with the other, resolving the contradiction by separating the melting/soldering process from the mechanical attachment process.
Solution Approach 2:
Different areas of the component carrier are assigned different properties: solder depots are created in specific contact areas for electrical connection, while surrounding areas are covered with adhesive for mechanical connection. This local differentiation allows the substrate to melt only where needed for soldering while the adhesive provides mechanical support in other areas.
2Reliability
If conductive adhesive is used for electrical connection, then electrical connection is improved, but mechanical connection becomes insufficient
Solution Approach 1:
The connection function is segmented into two distinct parts: solder depots for electrical connection and adhesive areas for mechanical connection. This segmentation allows each part to perform its specific function optimally without interfering with the other, resolving the contradiction by separating the melting/soldering process from the mechanical attachment process.
3Reliability
If protective layer is applied after LED fixation, then electrical connection is improved, but textile character is impaired
Solution Approach 1:
The protective function is extracted from a separate protective layer and integrated into the adhesive itself. The adhesive serves dual purposes: providing mechanical attachment and offering protective coverage. This eliminates the need for an additional protective layer that would compromise textile flexibility while still protecting the electrical connections.
4Reliability
If adhesive mixed with conductive particles is used, then electrical connection is improved, but application precision becomes difficult
Solution Approach 1:
The connection function is segmented into two distinct parts: solder depots for electrical connection and adhesive areas for mechanical connection. This segmentation allows each part to perform its specific function optimally without interfering with the other, resolving the contradiction by separating the melting/soldering process from the mechanical attachment process.
Solution Approach 2:
Solder depots act as intermediaries for electrical connection. Instead of mixing conductive particles throughout the adhesive, pure solder is applied in controlled depots that melt to create reliable electrical connections, while the surrounding adhesive provides mechanical support without conductive interference.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides a robust mechanical and reliable electrical connection that withstands repeated washing and is applicable to diverse textile materials, ensuring the functionality and flexibility of smart fabrics.
Implementation Method 1
at least two thermally conductive channels which lead from the first to the second surface and which are each thermally conductively connected to at least one solder depot
Implementation Method 2
The first surface of the component carrier is at least partially covered with an adhesive, in particular an adhesive film. The mechanical connection to the substrate can be established by the adhesive.
Implementation Method 3
The component has at least two solder depots, which are arranged on the first surface of the component carrier
Data Source
Figure 1
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Figure 4
AI summary
The invention relates to a component 1 for application to a flexible substrate 21, a method for producing a component of this kind, a component arrangement comprising a flexible substrate with conductor tracks and at least one component and a method for applying a component 1 to a flexible substrate. The component 1 comprises a component carrier 2 with a first surface 3 facing towards the substrate 21 and a second surface 4 opposite said first surface 3 and at least one component 5, 6 mounted on the component carrier 2 to which component current and/or voltage may be applied. The component carrier 2 has in particular at least two thermally conductive channels 9 which lead from the first surface 3 to the second surface 4, each connected in a thermally conductive manner to at least one solder pad 10, which is arranged on the first surface 3 of the component carrier 2. The first surface 3 of the component carrier 2 is at least partially coated with an adhesive 11. The solder pads are preferably heated inductively.