Camera Module Molding Base with Closed Light Window Filling

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Solution Overview

Problem

The existing molding process for camera modules faces challenges such as incomplete filling of flow passages, leading to gaps in the packaging portion and deformation of leads due to high viscosity of the packaging material, which affects the quality and reliability of the camera module.

Innovation Solution

The proposed solution involves a modified molding die design with a two-stage diversion groove structure and a filling groove arrangement that ensures the packaging material flows smoothly and fills all areas, preventing gaps and deformation, and integrating a light window molding portion to form a closed light window.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Volume of moving object

If the packaging material flows through narrow flow passages during molding, then the packaging material can reach distant areas, but the friction causes deformation and damage of the leads

Engineering Contradiction:
Improvefilling coverageVSAvoidlead deformation
Core Design Contradiction:
Volume of moving objectVSObject-affected harmful factors

Solution Approach 1:

The patent divides the single narrow flow passage into multiple wider flow passages by adding auxiliary flow passages. This segmentation reduces the friction on packaging material in each passage while expanding the total filling coverage, thereby preventing lead deformation during the molding process

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent introduces auxiliary flow passages that extend in different directions (another dimension) from the main flow passage, allowing packaging material to reach distant areas through multiple pathways rather than a single narrow path, thus reducing friction and preventing lead damage

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Strength

If the molding process uses high viscosity packaging material, then the material maintains structural integrity, but the material cannot fill flow passages completely causing gaps

Engineering Contradiction:
Improvematerial integrityVSAvoidfilling completeness
Core Design Contradiction:
StrengthVSManufacturing precision

Solution Approach 1:

The patent employs a two-stage molding process where packaging material viscosity is dynamically adjusted: first injected in a low-viscosity state to completely fill the flow passages and eliminate gaps, then cured to achieve the required structural integrity and strength in the final product

Inventive Principle:
Principle #15Dynamics

3Manufacturing precision

If the packaging material is injected quickly to fill passages before curing, then filling completeness improves, but the material may not distribute evenly causing defects

Engineering Contradiction:
Improvefilling completenessVSAvoidmaterial distribution uniformity
Core Design Contradiction:
Manufacturing precisionVSStability of the object's composition

Solution Approach 1:

The patent segments the flow passages into multiple auxiliary passages that distribute packaging material to different areas simultaneously. This segmented distribution ensures complete filling of all passages while maintaining uniform material distribution throughout the molding cavity, preventing defects

Inventive Principle:
Principle #1Segmentation

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach ensures the formation of a complete, one-piece molding base with an all-around closed light window, reducing the risk of defects and improving the assembly quality and reliability of the camera module.

Implementation Method 1

a fluid-like packaging material 4 flows forward along with the two flow passages 103 and 104, and fills into the intermediate flow passage 106 between two adjacent bumps 105

Methodology Applied
Scientific EffectFluid flow:

Implementation Method 2

the packaging material 4 is cured, the packaging portion 1 can be formed on the corresponding each of the circuit boards 2 and each of the photosensitive chips 3

Methodology Applied
Scientific EffectCuring: Photopolymerisation

Data Source

PatentEP4220724B1Camera module, photosensitive assembly, photosensitive assembly jointed panel, and molding die thereof and manufacturing method thereof
Publication Date: 2025.04.23 NINGBO SUNNY OPOTECH CO LTD
  • EP4220724B1 patent drawingFigure 1A
  • EP4220724B1 patent drawingFigure 1B~1C
  • EP4220724B1 patent drawingFigure 1D~1E

AI summary

Provided is a photosensitive assembly and a camera module, said photosensitive assembly comprising: a circuit board, a photosensitive element, and a filter element; the photosensitive element is operatively connected to the circuit board; the molding base is integrally molded with the circuit board and the photosensitive element and forms a light window, wherein the molding base has one or more first portion inner surfaces adjacent to the photosensitive element and one or more second partial inner surfaces connected to the first portion inner surface away from the photosensitive element; the filter element is mounted on a top side of the molding base, the filter element includes a filter element main body and at least one light shielding layer provided on at least one of a top side and a bottom side of the filter element main body, and a light suppression groove is formed between the light shielding layer, the first portion inner surface and the second portion inner surface , and on an outer side portion of the light window; said camera module comprising the photosensitive assembly and a lens; the filter element is located between the photosensitive element and the lens.