Camera Module Shake Compensation Using Memory Metal Actuation

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Solution Overview

Problem

Portable mobile terminals experience image quality disturbances due to physiological and external vibrations, causing camera modules to shake during picture or video capture.

Innovation Solution

A camera module design featuring a memory metal wire assembly that drives a second circuit board and photosensitive chip to move in a plane perpendicular to the lens's shaking direction, ensuring the optical axis alignment and compensating for lens shake, with an electrical connecting assembly and bent metal strips for stability and flexibility.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a traditional fixed camera module structure is used, then the structure is simple and stable, but the image quality deteriorates due to lens shake caused by vibration

Engineering Contradiction:
Improveimage qualityVSAvoidmodule structure
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent applies the dynamics principle by transforming the fixed camera module structure into a dynamic one. The photosensitive chip is mounted on a movable circuit board that can shift position in response to vibration detection, allowing the system to actively compensate for lens shake and maintain image quality under varying vibration conditions

Inventive Principle:
Principle #15Dynamics

Solution Approach 2:

The patent implements feedback by using a vibration sensor to detect shaking movements and automatically adjusting the position of the photosensitive chip accordingly. The control system processes vibration signals and drives the movable circuit board to counteract the detected shake, creating a closed-loop feedback mechanism that maintains stable imaging

Inventive Principle:
Principle #23Feedback

2Reliability

If the photosensitive chip is made movable to compensate for shake, then image quality improves, but the structural complexity and manufacturing difficulty increase

Engineering Contradiction:
Improveimage qualityVSAvoidassembly process
Core Design Contradiction:
ReliabilityVSEase of manufacture

Solution Approach 1:

The patent applies segmentation by dividing the camera module into distinct functional components: a fixed first circuit board, a movable second circuit board carrying the photosensitive chip, and separate vibration sensing and actuation systems. This modular segmentation allows each component to be manufactured and tested independently, simplifying the overall manufacturing process despite the added functionality

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent uses an intermediary approach by introducing a movable circuit board as a mediator between the fixed module structure and the photosensitive chip. This intermediate platform enables the chip to move independently for shake compensation while maintaining stable electrical connections through flexible circuits, thereby simplifying the integration complexity

Inventive Principle:
Principle #24Intermediary (Mediator)

3Reliability

If rigid connections are used for electrical connecting, then connection stability is high, but flexibility and response speed to vibration decrease

Engineering Contradiction:
Improveconnection stabilityVSAvoidresponse speed
Core Design Contradiction:
ReliabilityVSSpeed

Solution Approach 1:

The patent employs flexible circuits as thin film interconnects between the first and second circuit boards. These flexible connections maintain stable electrical contact while accommodating the relative motion between boards, enabling rapid response to vibration without compromising connection reliability due to their inherent flexibility and low mass

Inventive Principle:
Principle #30Flexible shells and thin films

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Improves image quality by effectively compensating for lens shake, enhancing stability and flexibility of the photosensitive chip's movement, and reducing reaction forces on the circuit board.

Implementation Method 1

a memory metal wire assembly (50) mounted on the first circuit board (10)... used to drive the second circuit board (20) and the electrical connecting assembly (40) to move

Methodology Applied
Scientific EffectMemory metal wire: Shape Memory Alloy

Data Source

PatentUS12004297B2Camera module and electronic device having the same
Publication Date: 2024.06.04 TRIPLE WIN TECH (SHENZHEN) CO LTD
  • US12004297B2 patent drawing
  • US12004297B2 patent drawing
  • US12004297B2 patent drawing

AI summary

A dustproof member includes a base plate, a dustproof plate, and a connecting portion. A first through hole is defined by an inner surface of the base plate. A second through hole is defined by an inner surface of the dustproof plate. The connecting portion has a shape of a hollow barrel and defines a hollow cavity. Two opposite ends of the connecting portion are respectively connected to an end of the inner surface of the base plate and an end of the inner surface of the dustproof plate, thereby forming a dust collecting groove between the base plate and the dustproof plate. A camera module having the dustproof member and an electronic device having the camera module are also provided.