Circuit Optical Details TRIZ Cases
- Optical Module Connection Substrate Impedance Control
Adjustable signal and ground pad spacing on the connection substrate resolves impedance mismatching while enabling miniaturization of flexible printed circuits.
- Backlight Unit Light Guide Plate Wedge Groove Design
A flexible printed circuit board groove prevents light leakage from a wedge-type light guide plate by suppressing elastic strength and maintaining contact.
- Opto-Electric Hybrid Module Substrate-Free Circuit Integration
A substrate-free opto-electric hybrid module forms the electric circuit directly on the under cladding layer to reduce distance between optical elements and the core.
- Radiation Beam Window With Carbon Fiber Foam Core
A radiation beam window uses a low-density foam core with carbon fiber skins to provide structural support and electrical biasing.
- Component Carrier With Cavity Stack For Optical Component Protection
A component carrier embeds optical elements in a cavity stack to provide mechanical protection and electrical connectivity.
- Camera Module Shake Compensation Using Memory Metal Actuation
Memory metal wire assemblies move the photosensitive chip perpendicular to vibration to compensate for lens shake and maintain image quality.
- Circuit Board Aperture for Non-Destructive Component Replacement
A circuit board aperture accepts a changeable part with electrical components, enabling secure mechanical locking through cooperative connection portions.
- Optical Module With Reflecting Groove And Side Lens Arrays
A compact optical module uses a reflecting groove and side-mounted lens arrays to route light between photoelectric chips.
- Optical Receiving Module Assembly Using Transparent Mount
Transparent mount eliminates flexible printed circuit boards to minimize RF transmission loss and enhance electrical bandwidth.
- Selective Reflective Coating for LED Substrates via Bond Strength
A reflective compound bonds strongly to ceramic but weakly to metal, enabling selective coating removal through mechanical treatment.
- Metal Mesh Conductive Layer for Touch Screen Etching Elimination
A metal mesh conductive layer replaces ITO films in touch screens to simplify manufacturing through direct imprinting.