Circuit Optical Details TRIZ Cases

Adjustable signal and ground pad spacing on the connection substrate resolves impedance mismatching while enabling miniaturization of flexible printed circuits.

A flexible printed circuit board groove prevents light leakage from a wedge-type light guide plate by suppressing elastic strength and maintaining contact.

A substrate-free opto-electric hybrid module forms the electric circuit directly on the under cladding layer to reduce distance between optical elements and the core.

A radiation beam window uses a low-density foam core with carbon fiber skins to provide structural support and electrical biasing.

A component carrier embeds optical elements in a cavity stack to provide mechanical protection and electrical connectivity.

Memory metal wire assemblies move the photosensitive chip perpendicular to vibration to compensate for lens shake and maintain image quality.

A circuit board aperture accepts a changeable part with electrical components, enabling secure mechanical locking through cooperative connection portions.

A compact optical module uses a reflecting groove and side-mounted lens arrays to route light between photoelectric chips.

Transparent mount eliminates flexible printed circuit boards to minimize RF transmission loss and enhance electrical bandwidth.

A reflective compound bonds strongly to ceramic but weakly to metal, enabling selective coating removal through mechanical treatment.

A metal mesh conductive layer replaces ITO films in touch screens to simplify manufacturing through direct imprinting.

Buried optical waveguides adopt an obtuse angle curvature instead of a right angle bend to reduce tensile stress and prevent breakage during light transmission.

Nested retention structures mechanically constrain polymer lenses within a photonics device cap, eliminating glue adhesion failure under thermal stress.

Curved metal detection wires scatter incident light to reduce visible glare, resolving the trade-off between high sensitivity and display clarity.

Cured polysiloxane coatings replace water-soluble clays to prevent hygroscopic adhesion failure and sustain heat dissipation.

Precise control of printing layer surface roughness and straightness prevents electrode shorts and delamination in touch panels.

Monolithic backside lenses on photodetector dies focus light onto small active areas, resolving alignment tolerance issues in high-speed optical receivers.

Photonic integrated circuits convert optical signals to electrical data, supporting 200 Tbps throughput while managing heat in dense chip packages.

Segmented insulating layers and planarization improve surface flatness, enabling accurate alignment for fine features without increasing process complexity.

Segmented metal layers reinforce optical element mounting pads on hybrid boards to maintain structural integrity during assembly.

Segmented sub-mounts with dynamic conductive paths resolve manufacturing complexity while maintaining adaptability to varied product specifications.

Nested reinforcing members and a recessed groove protect the driving chip, reducing display defects from impacts.

An orthogonal substrate arrangement couples photonic devices to electronic circuits via edge-coupled waveguides.

A connecting board groove accommodates a protruding circuit board to increase spacing, preventing bracket collision during active alignment.

Replacing inorganic black pigments with selective organic alternatives resolves the trade-off between wiring pattern concealability and insulating reliability.

A reinforced plate intercepts conductive lines cut by the chip hole, enabling vertical embedding without expanding the circuit board width.

Attractive magnetic field forces between substrates prevent relative displacement in display panels.

Liquid inorganic white insulating layers replace organic materials to resolve poor thermal conductivity and discoloration issues in high-density LED modules.

Selective electron beam welding joins silver nanowire junctions, avoiding thermal damage to non-junction areas and reducing sheet resistance.

A memory device substrate integrates a heat dissipation structure with a light guide element to channel light beams through defined gaps.

Opaque conductor tracks on a transparent film ensure uniform optical transparency for large-area facades without visible disruption.

Graphene traces integrated into a polymeric substrate form an electrically conductive tamper detection circuit.

Asymmetric copper wiring shapes reduce specular reflection to resolve viewing angle dependency in touch panels.

A composite flexible circuit substrate positions optical and electrical circuits near the neutral surface to enhance bending resistance.

Laser-ablated optical vias in a glass-polymer interposer enable high-density I/O connections by replacing electrical traces with low-loss waveguides.

Staggered microlenses expand beam diameters beyond fiber pitch constraints, reducing alignment precision requirements while increasing contamination resistance.

Protruded core portion in optical waveguide reduces positional displacement and transmission losses between light emitting elements and receiving elements.

A rigid-flexible printed circuit board integrates optoelectronic components in cavities with structured optical waveguides.

A folded flexible circuit connects to a stiffener panel for oximetry sensors.

A flexible substrate defines a pre-marked area on the solder mask layer for an identifying code.

Segmented surface mount LED elements on a substrate with a fluorescent layer reduce glare and multiple shadows while enabling high-power operation.

Laminating a dry-film layer onto a printed circuit board substrate creates a planar surface that reduces optical loss caused by topography variations.

Segmenting the printed circuit board isolates the image sensor from strain, maintaining lens alignment.

A flexible cover window uses a retardation film to uniformly distribute penetrating rays and reduce phase differences between reflected light.

Via connections replace connectors to reduce noise and transmission delays.

Spacing blocks in nil-light areas reduce glue coverage, preventing luminance attenuation and touch misjudgment.

Inkjet deposition creates hemispherical micro-lens patterns, replacing complex lithography to improve manufacturing precision and reproducibility.

Introducing a dedicated non-transparent layer between LEDs and the shelter layer conceals pinholes caused by uneven coating processes.