Component Carrier With Cavity Stack For Optical Component Protection
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Solution Overview
Problem
Conventional optical components mounted on component carriers, such as printed circuit boards, face reliability and damage issues due to their exposed arrangement, which complicates efficient and robust assembly.
Innovation Solution
A component carrier design featuring a stack with a central section surrounded by a cavity section and a vertical opening, allowing for the partial or full accommodation of electronic elements, which enhances mechanical protection and assembly efficiency while providing electrical connectivity through conductive layers and optional functional coatings.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If optical components are mounted on the surface of component carriers using socket connection, then assembly is simple and accessible, but reliability is limited and components are exposed to damage
Solution Approach 1:
The patent embeds optical components within a cavity formed in the component carrier stack, nesting the component inside the carrier structure rather than mounting it on the surface. This nested arrangement protects the component while maintaining integration within the carrier body.
Solution Approach 2:
The invention transitions from surface mounting (2D arrangement) to embedded mounting within a cavity (3D arrangement). By creating a cavity through selective removal of material from the stack, the component can be positioned within the carrier volume, providing mechanical protection while improving reliability.
2Strength
If a stack with different section thicknesses is created to form a cavity, then mechanical protection is improved, but manufacturing complexity increases
Solution Approach 1:
The stack is divided into different sections with different thicknesses - a first section that is selectively removed to form a cavity, and a second section that remains to provide structural support. This segmentation allows the cavity to be formed while maintaining the overall structural integrity of the carrier.
Solution Approach 2:
Material is selectively removed from the first section of the stack to create the cavity. This extraction process creates the protective cavity structure while leaving the second section intact to maintain mechanical strength and provide external support.
3Adaptability or versatility
If vertical openings are formed in the cavity stack section for component accommodation, then component integration is improved, but structural integrity may be compromised
Solution Approach 1:
The stack structure has different local qualities - the first section is designed to be removed to form the cavity opening, while the second section maintains full thickness to provide structural support. This local differentiation allows openings for component integration without compromising overall structural integrity.
Data Source
AI summary
A component carrier includes a stack with at least one electrically conductive layer structure and at least one electrically insulating layer structure. The stack has at least one central stack section, at least one cavity stack section, and at least one vertical opening formed in the cavity stack section. The cavity stack section at least partially surrounds the central stack section, and the thickness of the central stack section is greater than the thickness of the cavity stack section.