Optical Receiving Module Assembly Using Transparent Mount

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Solution Overview

Problem

Existing optical receiving module assemblies face challenges with RF transmission loss due to the thickness and manufacturing errors of flexible printed circuit boards (FPCBs), which also complicate alignment and increase costs.

Innovation Solution

The optical receiving module assembly uses a glass or plastic mount with a transparent material to connect the electronic device to the optical component, minimizing transmission line length and eliminating the need for FPCBs and package feedthroughs, thereby enhancing electrical bandwidth and reducing manufacturing costs.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of operation

If a flexible printed circuit board (FPCB) is used to connect the electronic device to the optical component, then flexibility and ease of bonding are improved, but transmission line length increases causing RF transmission loss and reduced electrical bandwidth

Engineering Contradiction:

Improveease of bondingVSAvoidRF transmission loss

Core Design Contradiction:

Ease of operationVSLoss of energy

Solution Approach 1:

The patent extracts and removes the FPCB from the system entirely, replacing it with a direct mounting structure where the optical component is mounted directly onto the PCB with electrical connection pads, eliminating the intermediate flexible circuit board that caused transmission losses

Inventive Principle:

Principle #2Taking out (Extraction)

Solution Approach 2:

The patent merges the functions of the FPCB (electrical connection and positioning) directly into the PCB structure by providing mounting pads and electrical connection terminals on the PCB itself, combining multiple functions into a single integrated structure

Inventive Principle:

Principle #5Merging (Combining)

2Ease of operation

If the FPCB is designed with certain length for securing flexibility, then ease of bonding is improved, but transmission line length increases reducing electrical bandwidth

Engineering Contradiction:

Improveease of bondingVSAvoidelectrical bandwidth

Core Design Contradiction:

Ease of operationVSReliability

Solution Approach 1:

The patent removes the FPCB component entirely from the system, replacing it with a direct mounting approach where optical components are mounted directly on the PCB, thereby eliminating the transmission line and preserving electrical bandwidth

Inventive Principle:

Principle #2Taking out (Extraction)

3Ease of operation

If the FPCB thickness is reduced for flexibility, then flexibility is improved, but manufacturing precision becomes more difficult due to line width requirements

Engineering Contradiction:

ImproveflexibilityVSAvoidline width accuracy

Core Design Contradiction:

Ease of operationVSManufacturing precision

Solution Approach 1:

The patent extracts and eliminates the FPCB from the system, replacing it with a rigid PCB mounting structure that has standardized pad dimensions and tolerances, thereby removing the manufacturing precision challenges associated with thin flexible circuits

Inventive Principle:

Principle #2Taking out (Extraction)

4Reliability

If a package feedthrough is used to connect the electrode of the FPCB to optical devices, then electrical connection is achieved, but manufacturing cost increases

Engineering Contradiction:

Improveelectrical connectionVSAvoidmanufacturing cost

Core Design Contradiction:

ReliabilityVSEase of manufacture

Solution Approach 1:

The patent removes the package feedthrough component from the system, replacing it with direct electrical connection pads and terminals on the PCB that provide the same electrical connection function without the additional cost of specialized feedthrough components

Inventive Principle:

Principle #2Taking out (Extraction)

Solution Approach 2:

The patent uses standard PCB traces and pads instead of expensive package feedthroughs, employing cheaper, more readily available manufacturing techniques that achieve the same electrical connection function

Inventive Principle:

Principle #27Cheap short-living objects (Disposable)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution minimizes RF transmission loss, enhances electrical bandwidth, and achieves product miniaturization while reducing manufacturing costs by eliminating the need for FPCBs and package feedthroughs.

Implementation Method 1

an electrode formed in the electronic device and the mount electrode may be bonded to each other by a solder bump which is cooled after being melted by a high power laser passing through the mount including the transparent material

Methodology Applied

Scientific EffectLaser heating: Laser

Data Source

PatentUS20250076601A1Optical receiving module assembly

Publication Date: 2025.03.06 ELECTRONICS & TELECOMM RES INST

AI summary

An optical receiving module assembly is provided. The optical receiving module assembly includes an electric sub-assembly including a printed circuit board (PCB) including an opening portion and an electronic device mounted on the PCB and an optical receiving module including a first optical component mounted on the PCB and a second optical component mounted on the mount which includes a transparent material and is disposed in the opening portion, wherein the electronic device and the second optical component are electrically connected to each other by a mount electrode formed on a surface of the mount.