Optical Module With Reflecting Groove And Side Lens Arrays
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Solution Overview
Problem
The increasing number of optical fibers required for higher transmission rates necessitates larger optical modules, which are undesirable for integrated packaging and increase manufacturing costs, while existing solutions fail to efficiently reduce the volume and cost of optical modules for multi-channel transmission.
Innovation Solution
The optical module design includes a circuit board with sequentially arranged driving and photoelectric chips, a lens assembly with grooves and reflecting surfaces, and side-mounted lens arrays that reflect light for efficient multi-channel transmission, reducing the module's volume and manufacturing costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the number of optical fibers is increased to achieve higher transmission rates, then the transmission capacity is improved, but the optical module volume increases
Solution Approach 1:
The patent transitions from a conventional planar arrangement of optical components to a three-dimensional configuration utilizing vertical stacking and angular positioning. Multiple lens arrays are arranged at different heights and angles within the housing, creating multi-layer optical paths that enable increased transmission capacity without proportional increases in footprint area.
Solution Approach 2:
The patent implements a nested structure where multiple lens arrays and optical components are positioned within each other's spatial envelopes. The lens arrays are arranged concentrically and at varying depths, with inner arrays positioned closer to the photoelectric chips and outer arrays extending toward the housing walls, maximizing space utilization.
2Productivity
If the optical module volume is increased to accommodate more optical fibers, then the transmission rate is improved, but the manufacturing cost increases
Solution Approach 1:
The patent designs the lens arrays and housing structure to serve multiple functions simultaneously. The same lens arrays facilitate light transmission for multiple optical fibers, while the angular positioning of components also optimizes heat dissipation pathways and simplifies assembly procedures. The housing walls are configured to provide both structural support and optical isolation functions.
3Productivity
If the number of optical fibers is increased to achieve higher transmission rates, then the transmission capacity is improved, but the integrated packaging becomes more difficult
Solution Approach 1:
The patent divides the optical module into distinct functional segments: photoelectric chip assemblies, lens array modules, and housing sections. Each lens array is positioned as a separate component that can be independently manufactured and tested before final assembly. The circuit board is segmented to accommodate multiple photoelectric chips with dedicated mounting areas for each lens array.
Solution Approach 2:
The patent utilizes the vertical dimension and angular space within the housing to arrange multiple lens arrays at different heights and orientations. This three-dimensional configuration allows optical paths for multiple fibers to be routed through the same horizontal footprint, reducing the complexity of planar layout and interconnection routing.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances light transmission channels, decreases the optical module's volume, and lowers manufacturing costs by allowing simultaneous multi-channel transmission while maintaining compactness.
Implementation Method 1
A bottom surface of the first groove comprises a reflecting surface. The first photoelectric chip is configured such that light coming from or to the first photoelectric chip is reflected by the reflecting surface and passes through the first lens array.
Data Source
AI summary
An optical module includes a circuit board, a lens assembly, a first lens array and a second lens array. The circuit board includes a first driving chip, a first photoelectric chip, a second photoelectric chip and a second driving chip. The lens assembly houses the first photoelectric chip and the second photoelectric chip and includes an upper surface having a first groove and a second groove. The first lens array and the second lens array are on a side surface of the second groove. A bottom surface of the first groove includes a reflecting surface. The first photoelectric chip and the second photoelectric chip are configured such that light coming from or to the first photoelectric chip, or from or to second photoelectric chip, is reflected by the reflecting surface and passes through the first lens array or the second lens array.