Camera Module Packaging with Integrated RDL and Encapsulation
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Solution Overview
Problem
Current lens modules face challenges in miniaturization and thinning due to the separation of photosensitive chips and functional components, leading to increased dimensions and reduced signal transmission speed, which affects imaging performance and shooting speed.
Innovation Solution
The integration of photosensitive chips and functional components within an encapsulation layer, along with a redistribution layer, reduces the distance between components and eliminates the need for a circuit board, thereby enhancing signal transmission speed and module thickness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If photosensitive chips and functional components are separated and mounted on a circuit board, then ease of manufacture is improved, but module thickness increases and signal transmission speed decreases
Solution Approach 1:
The patent merges the photosensitive chip and functional components into a single integrated package within the same encapsulation layer. The photosensitive chip is mounted on a first carrier substrate while functional components are mounted on a second carrier substrate, both within the same module structure, eliminating the need for separate circuit board mounting and reducing overall module thickness.
Solution Approach 2:
The patent transitions from a planar circuit board layout to a three-dimensional stacked architecture where components are arranged in different layers and carrier substrates. This vertical stacking approach allows components to be positioned in multiple dimensions, reducing the horizontal footprint and enabling thinner module overall thickness.
2Ease of manufacture
If photosensitive chips and functional components are separated and mounted on a circuit board, then ease of manufacture is improved, but signal transmission speed deteriorates
Solution Approach 1:
By integrating both photosensitive chips and functional components within the same encapsulation layer and using direct bonding between carrier substrates, the patent reduces signal transmission distance and eliminates intermediate routing through circuit boards, thereby improving signal transmission speed while maintaining manufacturability.
Solution Approach 2:
The patent extracts the circuit board from the traditional separate mounting layer and integrates its functionality directly into the carrier substrates and encapsulation structure. This removal of the intermediate circuit board layer reduces signal path length and improves signal transmission speed.
3Ease of manufacture
If a circuit board is used to mount components, then ease of manufacture is improved, but device complexity increases
Solution Approach 1:
The patent combines the functions of multiple separate components (photosensitive chip, functional components, and circuit board) into an integrated assembly where the carrier substrates and encapsulation layer work together as a unified structure. This merging reduces the number of discrete parts and simplifies the overall device architecture.
Solution Approach 2:
The encapsulation layer serves multiple functions simultaneously: it protects the components, provides structural support, enables direct electrical connections between carrier substrates, and eliminates the need for separate circuit board mounting. This multi-functionality reduces device complexity by consolidating multiple roles into a single component.
Data Source
AI summary
The present disclosure provides a method for packaging a camera assembly. The method includes providing a photosensitive chip having a plurality of first soldering pads; mounting a filter on the photosensitive chip; providing a first carrier substrate; and bonding a plurality of functional components and the photosensitive chip to the first carrier substrate. The plurality of functional components has a plurality of second soldering pads, and the first soldering pads and the second soldering pads all face away from the first carrier substrate. The method includes forming an encapsulation layer to cover the first carrier substrate, the photosensitive chip, and the functional components. The encapsulation layer exposes the filter. The method further includes forming a redistribution layer structure, on one side of the encapsulation layer close to the filter, to electrically connect to the first soldering pads and the second soldering pads; and removing the first carrier substrate.