Printed Circuit Assembling TRIZ Cases

Segmented chambers isolate conductive elements while fluid circulation dissipates heat from embedded components, reducing parasitic capacitance.

A compact module uses face-mounted electrodes to connect components directly to circuit boards.

A bendable circuit sheet connects LED light sources to power supplies via direct soldering pads.

A BGA support structure uses segmented positioning components to assemble a support film on a PCB and interface plate.

Reflow soldering attaches contact bushings and components simultaneously, eliminating separate guide strip steps and reducing manufacturing complexity.

A solderless adhesive connector bonds to glass surfaces via conductive adhesive, preventing microcracks caused by high-temperature soldering.

A single-sided copper layer covers pre-drilled support holes to enable reliable electrical connections during wave soldering.

Side-face insertion of power semiconductor devices resolves the trade-off between surface area efficiency and easy replacement.

Integrates photosensitive chips and functional components within a single encapsulation layer to reduce module thickness.

Soldering a metal contact area on a potting frame to a printed circuit board surface automates mechanical connection.

An endoscope printed circuit board uses an expansion gap between opposing contact points to manage thermal stress.

An imaging controller selects an unobstructed field of view from multiple angles to resolve mounting verification failures caused by shield obstructions.

A light emitting device manufacturing method uses substrate protrusions to align elements during joining.

Mechanical vibration at 50-200 Hz prevents blade adhesion, eliminating mask scavenging and preserving component density without increasing pressure.

An insulative cover with a channel and front stopple creates a seamless plug connector assembly.

Segmented flexible printed circuit attachment parts with slits maintain pad-to-bump alignment during electrical connection.

A metal workpiece with contact elements couples a semiconductor package to a printed circuit board.

A soldering iron system uses a processor and temperature sensor to maintain constant tip heat.

A supply unit moves a restricting wall section with the cartridge to secure the device interior during operation.

A polymeric base guides leads through channels to connectors, providing mechanical stability against vibration without solder.

Localized ground terminals and anisotropic conductive films prevent electrostatic discharge malfunctions at bonding portions.

A board mounting terminal with a tapered recessed groove enhances capillary action to retain solder paste and prevent drips during reflow.

Vertical wiring penetrates magnetic layers to reduce unnecessary routing, enabling reliable three-dimensional mounting in thin substrates.

An interposer connector with integrated shielding resolves the trade-off between manufacturing simplicity and connection reliability for high-speed signals.

A mount assembly uses pillar-shaped parallel connection members to join substrates with high-density mounting.

A pin-less optical registration system aligns laminate elements using computer-managed correction factors and inductive bonding.

Bent flexible printed circuit board segments position cable electrodes to reduce distal end bulk.

Photochemical neutralization segments the adhesive layer to resolve throughput bottlenecks in microLED manufacturing while maintaining high precision.

A conductive adhesive layer incorporates white pigment to reflect light from semiconductor devices, enhancing luminance without adding separate reflective structures.

Lead guide tabs and spring contacts enable quick component replacement while reducing stress on solder interfaces.

Electromagnetic induction heats a sinter pre-layer to join large semiconductor substrates, resolving thermal expansion mismatch stress.

A height-controlling support jig positions electronic component pins for precise wave soldering on circuit boards.

Segmented conductive walls and an insulator layer shield camera modules from electromagnetic interference while dissipating heat to prevent thermal buildup.

Segmented internal electrodes and a gap layer cancel EMI noise while maintaining low power loss in DC/DC converters.

Segmented heat transfer pattern with through hole conductors resolves solder bridge risks while maintaining reliable joint formation.

A component mounting method shifts substrate processing to an alternate carrying line when components deplete.

Separating the sealing member from the frame substrate inner surface eliminates shear stress caused by resin shrinkage and thermal expansion differences.

Exposed internal electrode ends eliminate surrounding insulation space, increasing part mounting density.

Segmented inner and outer shields retain nitrogen around nozzles, reducing dross formation while allowing rapid access.

Repositioning binding marks inside the pin area increases pin spacing, resolving yield issues caused by reduced spacing in traditional layouts.

Fast-curing conductive adhesive maintains flexibility under thermal cycling to prevent power output loss in shingled photovoltaic modules.

Bobbin support portions transfer mechanical load from thin secondary windings to the printed circuit board, preventing overheating and structural failure.

A wiring member integrates a metal layer with an adhesive composition containing conductive particles, epoxy resin, and phenolic resin.

Segmenting the through hole cross-section and applying a chevron bottom surface recovers excess flux during retraction, preventing overflow leakage.

Anisotropic conductors join component terminals to firmament circuits, eliminating hazardous lead and high-temperature damage risks.

A semiconductor substrate uses stepped electrodes to enhance wire bonding workability.

Elevated connection pads prevent electrical shorts during fine pitch mounting, resolving reliability complexity trade-offs.

An electronic device transfer apparatus compensates for handler holder misalignment via imaging based offset calculation, reducing damage risk.

An integrated driving module with energy conversion function reduces size and improves precision.