PCB Pad Elevation for Fine Pitch Mounting
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Solution Overview
Problem
The challenge in the electronics industry is to create smaller and more multifunctional semiconductor devices with fine pitch connection terminals, where defects often occur during the mounting process of semiconductor chips on printed circuit boards due to the complexity of connecting fine pitch connection terminals.
Innovation Solution
A printed circuit board design featuring a base substrate with a chip mounting region, connection pad structures, and an extension pattern, where the connection pad structures are partially embedded in the substrate, allowing for a higher upper surface level than the extension pattern, which reduces the risk of electrical shorts and improves contact reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If connection pad structures are made higher than the extension pattern to prevent electrical shorts, then reliability improves, but manufacturing complexity increases
Solution Approach 1:
The connection pad structures are elevated to a higher level than the extension pattern by embedding both in the base substrate at different depths. This vertical dimensional differentiation creates a height difference that prevents electrical shorts while maintaining planar integration, resolving the contradiction between reliability and structural simplicity.
Solution Approach 2:
Different regions of the base substrate are differentiated locally: the connection pad structures are embedded to a first depth while the extension pattern is embedded to a greater second depth. This localized variation in embedding depth creates the necessary height difference for electrical isolation without complicating the overall manufacturing process.
2Volume of moving object
If fine pitch connection terminals are used to reduce device size, then miniaturization improves, but manufacturing precision requirements worsen
Solution Approach 1:
The extension pattern is formed and embedded in the base substrate before the connection pad structures are added. This preliminary action creates a stable, pre-positioned reference structure that guides subsequent alignment processes, enabling precise placement of fine pitch connection terminals while facilitating miniaturization.
Solution Approach 2:
The extension pattern serves as an intermediary element between the base substrate and the connection pad structures. It provides a reference framework that mediates the alignment process, ensuring precise positioning of fine pitch terminals during manufacturing while enabling device miniaturization.
Data Source
AI summary
A printed circuit board is provided. The printed circuit board comprises a base substrate comprising a chip mounting region on an upper surface thereof, a plurality of connection pad structures in the chip mounting region, and an extension pattern on the base substrate, spaced from each of two adjacent connection pad structures from among the plurality of connection pad structures, and extending along the two adjacent connection pad structures. Upper surfaces of the plurality of connection pad structures are positioned at a higher level than an upper surface of the extension pattern.