Metal Workpiece Heatsink for Semiconductor Package Thermal Management
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Solution Overview
Problem
Existing electronic devices with printed circuit boards (PCBs) face challenges in achieving optimal electrical and thermal performance, as well as mechanical stability, particularly in high-power applications such as three-phase inverters, where conventional solutions often compromise on either electrical conductivity, thermal management, or mechanical integrity.
Innovation Solution
The integration of metal workpieces with multiple contact elements and a heatsink function, which provide both electrical coupling and thermal dissipation, while also serving as mechanical stabilizers, directly connected to semiconductor packages and PCBs, allowing for efficient heat transfer and high current carrying capabilities without additional traces.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional PCB solutions are used for high-power applications, then the device complexity is reduced, but the electrical and thermal performance deteriorates
Solution Approach 1:
The patent combines multiple functions into the metal workpiece: electrical connection (contact elements), thermal management (heatsink), and mechanical support (mounting structure). This integration resolves the contradiction by achieving high electrical and thermal performance through functional merging while the simplified modular design actually reduces overall device complexity compared to conventional separate-component approaches.
Solution Approach 2:
The metal workpiece serves multiple functions simultaneously: it provides electrical connections via contact elements, acts as a heatsink for thermal dissipation, and provides mechanical support for mounting semiconductor packages. This multi-functionality directly addresses the contradiction by improving electrical and thermal performance while reducing the number of separate components needed.
2Reliability
If additional high-current traces are added to PCB, then the electrical conductivity is improved, but the device complexity and manufacturing difficulty increase
Solution Approach 1:
The patent extracts the high-current conduction function from the PCB trace system and relocates it to dedicated metal contact elements on the metal workpiece. This extraction resolves the contradiction by providing superior electrical conductivity through metal-to-metal contacts while simplifying PCB manufacturing, as the PCB no longer requires complex high-current trace layouts.
3Reliability
If metal workpieces with multiple functions are integrated, then the thermal dissipation and electrical performance are improved, but the manufacturing precision requirements increase
Solution Approach 1:
The patent segments the device into modular components: the metal workpiece with integrated heatsink and contact elements, and the PCB assembly. This segmentation resolves the manufacturing precision challenge by allowing each module to be manufactured and tested independently, then assembled together, thereby maintaining high thermal and electrical performance while reducing overall manufacturing complexity.
4Reliability
If conventional PCB layouts are used, then the ease of manufacture is maintained, but the mechanical stability and thermal management deteriorate
Solution Approach 1:
The patent merges the mechanical support function with the thermal management function by integrating the heatsink directly into the metal workpiece that also provides structural support. This resolves the contradiction by improving mechanical stability and thermal management simultaneously, while the standardized metal workpiece design maintains ease of manufacture through modular assembly.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances electrical and thermal performance, reduces the need for additional high-current traces, improves mechanical stability, and enables efficient heat dissipation, leading to improved efficiency and reliability in high-power applications like three-phase inverters.
Implementation Method 1
The metal workpiece (12) is mounted on the PCB (11)... providing an electrical coupling between the semiconductor package (10) and the PCB (11)... heatsink function... efficient heat transfer
Implementation Method 2
contact elements... providing an electrical coupling between the semiconductor package (10) and the PCB (11)... high current carrying capabilities
Data Source
AI summary
A device including a first semiconductor package that includes a semiconductor chip, an encapsulation material at least partly covering the semiconductor chip, and a contact element electrically coupled to the semiconductor chip and protruding out of the encapsulation material. In addition, the device includes a printed circuit board (PCB), wherein the first semiconductor package is mounted on the PCB and the contact element of the first semiconductor package is electrically coupled to the PCB. The device further includes a first metal workpiece mounted on the printed circuit board and electrically coupled to the contact element of the first semiconductor package.