Pin-less Optical Registration for PCB Lamination
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Solution Overview
Problem
Conventional alignment systems in printed circuit board manufacturing, such as pin-based and riveting systems, suffer from high tolerance errors that accumulate during the lamination process, leading to inaccurate layer registration and inflexibility in handling different panel sizes, resulting in increased costs and reduced quality control.
Innovation Solution
A pin-less optical registration system with a pre-alignment station and computer-managed monitoring system for determining correction factors, combined with inductive bonding, allows for accurate and flexible alignment of laminate elements without the need for tooling holes, enabling precise layer-to-layer registration and reduced handling errors.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If pin-based or riveting alignment systems are used, then layers can be fixed relative to each other, but alignment tolerance errors accumulate and accuracy deteriorates
Solution Approach 1:
The patent removes the alignment pins and tooling holes from the lamination process entirely. Instead of using physical pins to register layers, the system uses a pin-less registration method where layers are aligned and bonded without any mechanical registration features, thereby eliminating the source of tolerance accumulation
Solution Approach 2:
The patent replaces the mechanical pin-based alignment system with an optical/electronic alignment system. The process uses optical alignment marks and electronic control to achieve layer registration, substituting mechanical contact with non-contact optical measurement and control
2Adaptability or versatility
If conventional alignment systems with tooling holes are used, then layers can be registered, but the system becomes inflexible for different panel sizes
Solution Approach 1:
The pin-less registration system serves as a universal alignment method that works for all panel sizes without requiring different tooling configurations. The same alignment process and equipment can handle various panel dimensions, making the system multi-functional and adaptable
3Productivity
If pin-based alignment systems are used, then layers can be held in position, but labor and operational cycles increase
Solution Approach 1:
By removing the pins and tooling holes from the process, the patent eliminates the time-consuming steps of inserting, positioning, and removing alignment pins. The pin-less system streamlines the lamination process, reducing both labor requirements and operational cycles
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution significantly improves layer-to-layer alignment accuracy to within ±17 microns, reduces labor and operational cycles, and allows for flexible panel sizes without the need for multiple tooling sets, enhancing yield and handling speed while minimizing errors and costs.
Implementation Method 1
a ferromagnetic core having an alternating current winding is positioned proximate the endothermic heating pile and induces an inductive field within the copper laminae to warm the heating pile
Implementation Method 2
induces an inductive field within the copper laminae to warm the heating pile (which includes resin sheets (also known commonly as 'pre-preg'))
Data Source
AI summary
The present invention relates to a pin-less registration method for a plurality of laminate elements in a selected stack orientation. The method involves the use of an optical step that images portions of each laminate and determines a required correction factor between an alignment of the laminate element at the pre-alignment station and a preferred stack orientation for the laminate element. A computer operation control system provides instructions for positioning laminate elements to a corrected stack orientation during an assembly of the stack. Following the assembly of the stack an induction welding step occurs at predetermined locations to secure the pinless alignment.