Integrated Driving Module for Smartphone Image Stabilization
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Solution Overview
Problem
Conventional magnetic driving devices for image stabilization in smartphones are bulky due to multiple components from different manufacturers, leading to high thickness, low precision, and increased costs, making it difficult to reduce size and cost effectively.
Innovation Solution
An integrated driving module with energy conversion function is developed, incorporating a patterned conductive circuit layer, integrated electromagnetic induction component layer, dielectric layers, and embedded electrical components, formed through semiconductor manufacturing processes to reduce size and improve precision.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If multiple independent components are assembled to form a magnetic driving device, then the device can be manufactured by different manufacturers, but the overall thickness increases to 800 um and the device complexity increases
Solution Approach 1:
The patent merges multiple independent components (support frame, flexible circuit board, Hall sensor, flexible coil plate, and conductive connecting component) into a single integrated driving module manufactured as one piece through semiconductor manufacturing processes, eliminating the need for assembly and reducing overall thickness from 800 um to significantly thinner dimensions
Solution Approach 2:
The patent transitions from a three-dimensional assembled structure to a planar two-dimensional integrated circuit board design, where all components are laid out and connected on the same flexible circuit board plane, enabling thinner profile and more efficient space utilization
2Ease of manufacture
If multiple independent components are assembled manually, then the device can be manufactured by different manufacturers, but the production precision decreases and the yield is affected
Solution Approach 1:
The patent combines all previously separate components into a single integrated driving module that is manufactured using automated semiconductor manufacturing processes, ensuring high precision and consistency while eliminating manual assembly operations
Solution Approach 2:
The patent replaces manual mechanical assembly operations with automated semiconductor manufacturing processes, including photolithography, etching, and deposition, which provide superior precision and repeatability compared to manual assembly
3Ease of manufacture
If multiple independent components are assembled, then the device can be manufactured by different manufacturers, but the cost increases
Solution Approach 1:
The patent consolidates five separate components into one integrated driving module, reducing the number of parts that need to be manufactured, inventoried, and assembled, thereby simplifying the supply chain and reducing overall manufacturing cost
Solution Approach 2:
The integrated driving module serves multiple functions simultaneously (structural support, electrical connection, sensing, and electromagnetic actuation) within a single component, eliminating the need for multiple specialized components and reducing overall system complexity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The integrated module reduces overall size and thickness, enhances production yield, and improves product precision, enabling more efficient energy conversion and image stabilization while lowering costs.
Implementation Method 1
integrated electromagnetic induction component layer (200)
Implementation Method 2
Hall sensor 14
Data Source
AI summary
A manufacturing method of an integrated driving module with energy conversion function includes providing a carrier board and forming an integrated electromagnetic induction component layer having a first dielectric layer, a plurality of conductive coil layers and a plurality of conductive connecting components on a surface of the carrier board. A patterned conductive circuit layer is formed on the integrated electromagnetic induction component layer, and electrically connecting to each other through the conductive connecting components. An embedded electrical component is patterned on the patterned conductive circuit layer. A conductive component is disposed on the patterned conductive circuit layer. Thereafter, the method forms a second dielectric layer to cover the embedded electrical component and the conductive component and removes the carrier board to form a plurality of integrated driving modules.


