Wiring Member With Epoxy Phenolic Adhesive Layer

Solution Overview

Problem

The existing methods for producing substrates with embedded parts are complex and prone to issues such as air bubbles and peeling between the adhesive and the base material, which complicates the formation of conductive layers.

Innovation Solution

A member for forming wiring comprising a metal layer and an adhesive layer with conductive particles, epoxy resin, and phenolic resin, which simplifies the wiring layer formation process while reducing air bubbles and peeling by maintaining a long curing reaction and ensuring embeddability and uniform reactivity.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a conventional method using laser drilling and plating is used to form via electrodes, then conductive layers can be formed, but the producing process becomes extremely complicated requiring multiple repeated treatments

Engineering Contradiction:

Improveconductive layer formationVSAvoidproducing process complexity

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The patent combines the adhesive layer and metal wiring layer into a single integrated member for forming wiring. This merging eliminates the need for separate adhesive application and metal layer formation processes, significantly simplifying the producing process while maintaining reliable conductive layer formation.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The member for forming wiring serves multiple functions simultaneously: it provides adhesive bonding to attach the wiring layer to the substrate, provides the conductive metal layer for electrical connections, and provides structural support. This multi-functionality reduces the number of separate components and processes needed.

Inventive Principle:

Principle #6Universality (Multi-functionality)

2Device complexity

If an adhesive layer with conductive particles is used to simplify wiring layer formation, then the process is simplified, but air bubbles or peeling may occur between the cured adhesive and the base material

Engineering Contradiction:

Improveforming process simplicityVSAvoidadhesive bonding quality

Core Design Contradiction:

Device complexityVSReliability

Solution Approach 1:

The patent specifies precise parameter ranges for the adhesive layer including viscosity (100-10000 cP), thickness (10-100 μm), and conductive particle content (1-50 wt%). These controlled parameters ensure proper wetting and bonding to the base material, preventing air bubbles and peeling while maintaining process simplicity.

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

The adhesive layer is formulated as a composite material containing conductive particles dispersed in an adhesive matrix. This composite structure provides both bonding functionality and electrical conductivity, while the controlled composition ensures proper adhesion to the base material without causing defects like air bubbles or peeling.

Inventive Principle:

Principle #40Composite materials

3Ease of manufacture

If the adhesive layer contains only conductive particles and basic adhesive, then the formulation is simple, but sufficient conductivity and bonding reliability cannot be achieved simultaneously

Engineering Contradiction:

Improveadhesive formulation simplicityVSAvoidelectrical conductivity and bonding strength

Core Design Contradiction:

Ease of manufactureVSReliability

Solution Approach 1:

The adhesive layer is formulated as a composite material containing conductive particles dispersed in an adhesive matrix. This composite structure provides both bonding functionality and electrical conductivity, while the controlled composition ensures proper adhesion to the base material without causing defects like air bubbles or peeling.

Inventive Principle:

Principle #40Composite materials

Solution Approach 2:

The patent specifies precise parameter ranges for the adhesive layer including viscosity (100-10000 cP), thickness (10-100 μm), and conductive particle content (1-50 wt%). These controlled parameters ensure proper wetting and bonding to the base material, preventing air bubbles and peeling while maintaining process simplicity.

Inventive Principle:

Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The proposed solution simplifies the wiring layer formation process, reduces air bubbles and peeling, and ensures sufficient conductivity, thereby improving the efficiency and reliability of the wiring formation process.

Implementation Method 1

by the adhesive layer containing the epoxy resin and the phenolic resin, it is possible to maintain a curing reaction for a long period of time, and it is possible to obtain sufficient embeddability and uniform reactivity

Methodology Applied

Scientific EffectCuring reaction: Chemical Bonding

Implementation Method 2

by the adhesive layer containing the conductive particles, it is possible to obtain electrical conduction between the metal layer to be a wiring pattern or wiring after processing, and another wiring pattern or wiring that adheres via the adhesive layer

Methodology Applied

Scientific EffectElectrical conduction: Conduction (electrical)

Implementation Method 3

a step of thermocompressing the member for forming wiring to the base material

Methodology Applied

Scientific EffectThermocompressing: Compression

Data Source

PatentUS20250142722A1Member for forming wiring, method for forming wiring layer using member for forming wiring, and formed wiring member

Publication Date: 2025.05.01 RESONAC CORP

AI summary

A member 1 for forming wiring includes an adhesive layer 10 and a metal layer 20. The adhesive layer 10 is composed of an adhesive composition containing conductive particles 12 and a thermosetting component. The metal layer 20 is disposed on the adhesive layer 10. In such a member 1 for forming wiring, the adhesive layer contains an epoxy resin and a phenolic resin, as the thermosetting component.