Pillar-Shaped Mount Assembly for High-Density Substrate Connection
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing endoscope technologies face challenges in miniaturizing electronic circuit modules for body cavity observations, particularly in connecting substrates in a way that allows for high-density mounting and reliable electrical connections without complex processing.
Innovation Solution
A mount assembly and manufacturing method involving pillar-shaped connection members that connect substrates with parallel portions, allowing for easy integration and high-density mounting of electronic components, using electrodes and resins for secure connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If substrates are connected by inserting protrusions into holes in mutually perpendicular directions, then mechanical and electrical connections are achieved, but the device complexity and manufacturing difficulty increase
Solution Approach 1:
The connection structure is divided into separate functional elements: a protrusion formed on one substrate and a corresponding hole formed on another substrate. This segmentation allows each component to be independently manufactured and then assembled, simplifying the overall manufacturing process while maintaining connection reliability.
Solution Approach 2:
The connection method transitions from planar connections to three-dimensional connections by forming protrusions that extend in the thickness direction of substrates. This dimensional change enables mechanical interlocking and electrical connection simultaneously, achieving reliable connections without complex multi-step processes.
2Volume of moving object
If electronic circuit modules are miniaturized for body cavity observation, then the distal end of the insertion device can be thinned, but the manufacturing precision requirements increase
Solution Approach 1:
Protrusions and holes are pre-formed on substrates before final assembly. This preliminary action allows for precise positioning and alignment to be established in advance, ensuring that even miniaturized components can be connected with the required precision without compromising the compact size of the electronic circuit module.
Data Source
AI summary
A mount assembly includes a member in which a mount component is mounted at least on one main face of the member and at which a member connecting electrode is formed; and a connection member that has a pillar-shaped parallel portion arranged so that a longitudinal direction of the parallel portion is parallel to the main face of the member, one end side of the parallel portion being connected to the member connecting electrode.