MLCC Electrode Exposure for Mounting Density
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Solution Overview
Problem
Conventional multilayer ceramic capacitors face reduced part mounting density due to external electrodes surrounding the ceramic sintering body, requiring space for insulation, and have limitations in varying capacitance and adhesive force when mounted on printed circuit boards.
Innovation Solution
The multilayer ceramic capacitor design exposes internal electrodes to the top or bottom surface of the ceramic sintering body, allowing for electrical connection and forming external electrodes on these exposed areas to enhance adhesive force and facilitate manufacturing of embedded boards with varying capacitance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If external electrodes are formed to surround the ends of the multilayer ceramic sintering body, then electrical connection to internal electrode layers is achieved, but part mounting density is reduced due to required insulation space
Solution Approach 1:
The patent extracts the electrical connection function from the traditional surrounding external electrode structure and relocates it to exposed internal electrode ends. By taking out the external electrode formation and replacing it with exposed internal electrodes, the design eliminates the need for surrounding conductive structures while maintaining electrical connectivity, thereby increasing mounting density
Solution Approach 2:
Instead of forming external electrodes to surround the sintering body ends (conventional approach), the patent inverts the approach by exposing the internal electrodes themselves and forming external electrodes only on these exposed areas. This inversion of the traditional electrode configuration eliminates the need for large surrounding electrodes, solving the mounting density problem
2Reliability
If conventional external electrode configuration is used, then electrical insulation space is required, but this reduces the area available for mounting on printed circuit boards
Solution Approach 1:
The patent extracts the electrical insulation requirement from the surrounding external electrode structure and replaces it with a compact configuration where exposed internal electrode ends provide connection points. This extraction eliminates the need for large insulation spaces while maintaining electrical isolation, thereby preserving mounting area
Solution Approach 2:
The patent applies local quality by forming external electrodes only on the specific exposed areas of internal electrodes rather than surrounding the entire sintering body. This localized electrode formation provides necessary electrical connection and insulation only where required, maximizing the available mounting area on the printed circuit board
Data Source
AI summary
A multilayer ceramic capacitor includes a multilayer ceramic sintering body and one or two or more internal electrode units formed to be placed inside the multilayer ceramic sintering body. Each internal electrode unit includes first internal electrodes formed in the multilayer ceramic sintering body in such a way to be spaced apart from each other, one or more of both ends of one side of each of the first internal electrodes being formed to be exposed to the top or bottom surface of the multilayer ceramic sintering body, and second internal electrodes placed between the first internal electrodes, respectively, and formed in the multilayer ceramic sintering body in such a way to be spaced apart from each other, one or more of both ends of the other side of each of the second internal electrodes being formed to be exposed to the top or bottom surface of the sintering body.