Flexible Circuit Board Binding Mark Placement for Pin Spacing
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Solution Overview
Problem
Traditional display panels face reduced pin spacing due to binding marks on flexible circuit boards, leading to decreased product quality and yield.
Innovation Solution
A flexible circuit board design with binding marks positioned within the pin area, eliminating the need for additional binding mark location areas, allowing for increased pin spacing and improved alignment accuracy.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If binding marks are disposed at two sides of the pin area on the flexible circuit board, then alignment operation can be performed, but the total spacing length of the pins is reduced and pin spacing becomes smaller
Solution Approach 1:
The binding mark is repositioned from the traditional location at two sides of the pin area to a new location within the pin area itself. This spatial reconfiguration allows the binding mark to coexist with the pins in the same region, effectively utilizing the available space and eliminating the need to reduce pin spacing for binding mark accommodation.
Solution Approach 2:
The binding mark location is merged with the pin area, allowing both functions (alignment and pin placement) to occupy the same spatial region. This integration eliminates the conflict between binding mark space requirements and pin spacing requirements, enabling both to coexist without compromise.
2Measurement precision
If binding marks are disposed at two sides of the pin area, then alignment operation can be performed, but the utilization rate of the flexible circuit board decreases
Solution Approach 1:
The binding mark is integrated within the pin area, merging the alignment function with the pin placement region. This eliminates the need for separate binding mark location areas at the sides of the pin area, thereby increasing the usable space on the flexible circuit board and improving overall utilization rate.
Solution Approach 2:
The binding mark is extracted from the traditional side-location and repositioned to the pin area location. This extraction from the conventional configuration allows for more efficient space utilization by eliminating wasted space at the sides of the pin area.
3Measurement precision
If binding marks are disposed at two sides of the pin area, then alignment operation can be performed, but the quality and yield of products decrease
Solution Approach 1:
By repositioning the binding mark to a different spatial configuration (within the pin area rather than at the sides), the patent achieves the same alignment function while improving product quality and yield. This spatial reconfiguration likely improves manufacturing reliability by optimizing the layout for production processes.
Data Source
AI summary
A display apparatus and the flexible circuit board thereof are provided. A flexible circuit board, includes: a flexible substrate; a driving chip disposed on the flexible substrate, wherein the driving chips is configured to form a driving signal; a plurality of binding pins disposed on at least one side of the flexible substrate, wherein the binding pins are configured to bind and connect an external signal line to the driving chip; and a binding mark disposed on the flexible substrate and positioned at a pin area within two outermost binding pins of the binding pins, wherein the binding mark is configured to perform an alignment operation of the flexible substrate being applied with a binding operation.