Solderless Electronic Assemblies Using Anisotropic Conductors

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Solution Overview

Problem

The use of solder in electronic assembly poses health and environmental risks due to hazardous materials like lead, requires high-temperature processes that can damage components, and occupies space, making it undesirable for miniaturization and manufacturing efficiency.

Innovation Solution

The use of an anisotropic conductor to connect electronic component terminals directly to conductive circuits without solder, eliminating the need for high-temperature processes and additional material, thus forming a compact and reliable electrical circuit.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If solder is used to connect electronic components, then reliable electrical connection is achieved, but hazardous materials and environmental damage occur

Engineering Contradiction:

Improveelectrical connection reliabilityVSAvoidhazardous materials and environmental damage

Core Design Contradiction:

ReliabilityVSObject-generated harmful factors

Solution Approach 1:

The patent removes solder entirely from the assembly process, extracting the harmful substance while replacing it with a solderless connection method using conductive adhesive and reflow processing to achieve reliable electrical connections without lead or hazardous materials

Inventive Principle:

Principle #2Taking out (Extraction)

Solution Approach 2:

The patent changes the physical state and properties of the connection material by using conductive adhesive that is applied in a viscous state and then cured through reflow processing, transforming it into a solid conductive bond that provides reliable electrical connection without solder

Inventive Principle:

Principle #35Parameter changes

2Strength

If high-temperature soldering processes are used, then strong electrical connections are formed, but component damage increases

Engineering Contradiction:

Improveconnection strengthVSAvoidcomponent damage from heat

Core Design Contradiction:

StrengthVSObject-affected harmful factors

Solution Approach 1:

The patent changes the processing temperature parameters by using reflow processing at controlled temperatures that cure the conductive adhesive without subjecting components to the extreme heat of traditional soldering, forming strong connections while minimizing thermal damage

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

The patent replaces the thermal soldering process with a conductive adhesive bonding process that uses chemical curing and controlled reflow processing instead of high-temperature melting and solidification, achieving strong connections with reduced thermal exposure

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

3Reliability

If solder material is added between components, then electrical connection is achieved, but assembly size increases

Engineering Contradiction:

Improveelectrical connectionVSAvoidassembly size

Core Design Contradiction:

ReliabilityVSVolume of moving object

Solution Approach 1:

The patent uses a thin film of conductive adhesive that flows and conforms to the contact surfaces, creating a minimal-thickness connection layer that provides reliable electrical connection without adding significant volume to the assembly

Inventive Principle:

Principle #30Flexible shells and thin films

Solution Approach 2:

The patent removes the bulk material of traditional solder joints, replacing it with a thin conductive adhesive layer that provides equivalent electrical connection functionality with minimal space occupation, enabling miniaturization

Inventive Principle:

Principle #2Taking out (Extraction)

4Reliability

If soldering processes are used, then electrical connections are formed, but manufacturing complexity and energy consumption increase

Engineering Contradiction:

Improveelectrical connectionVSAvoidmanufacturing process complexity

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The patent merges the connection formation process with the existing reflow processing step used in surface mount technology, combining the adhesive curing with the standard thermal processing cycle to reduce the number of separate manufacturing steps and simplify production

Inventive Principle:

Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach avoids the chemical and environmental concerns of solder, reduces component damage, and allows for more compact and reliable electronic assemblies by eliminating the need for solder and high-temperature processes, enhancing manufacturing efficiency and miniaturization.

Implementation Method 1

connecting the component terminals to a first side of the firmament with an anisotropic conductor

Methodology Applied

Scientific EffectAnisotropic conduction: Anisotropy

Data Source

PatentUS8510935B2Electronic assemblies without solder and methods for their manufacture

Publication Date: 2013.08.20 FJELSTAD JOSEPH CHARLES

AI summary

A method for producing an assembly of electronic components and assemblies in accord with this, wherein the electronic components have component terminals. A conductive firmament having a first side and a second side is provided. Then the component terminals are connected to the first side of the firmament with an anisotropic conductor. A pattern is applied to the second side of said firmament. And portions of the firmament are removed based on the pattern, such that remaining portions of said firmament form the electrical circuit interconnecting the component terminals.